发明申请
- 专利标题： Method of conditioning polishing pad for semiconductor wafer
- 专利标题（中）： 调整半导体晶片抛光垫的方法
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申请号： US10979212申请日： 2004-11-03
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公开(公告)号： US20050164613A1公开(公告)日： 2005-07-28
- 发明人: Yoshiyuki Seike , Keiji Miyachi , Masahiko Amari , Ara Philipossian , Toshiro Doi
- 申请人： Yoshiyuki Seike , Keiji Miyachi , Masahiko Amari , Ara Philipossian , Toshiro Doi
- 申请人地址： JP Owariasahi-shi JP Tokorozawa-shi
- 专利权人： ASAHI SUNAC CORPORATION,Toshiro Doi
- 当前专利权人： ASAHI SUNAC CORPORATION,Toshiro Doi
- 当前专利权人地址： JP Owariasahi-shi JP Tokorozawa-shi
- 优先权： JP2004-020018 20040128
- 主分类号： B24B53/007
- IPC分类号： B24B53/007 ; B24B53/017 ; H01L21/304 ; B24B1/00
摘要：
Dressing is performed by spraying a cleaning liquid onto a polishing pad and after that abrasive slurry injected from a nozzle is supplied to the polishing pad. Provided is a method of conditioning a polishing pad for semiconductor wafer which is suitable for keeping the polishing performance of a polishing pad, provided with a polishing device for semiconductor wafer, in a stable condition for a long time.
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