发明申请
- 专利标题: Curable composition
- 专利标题(中): 可固化组合物
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申请号: US11091509申请日: 2005-03-29
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公开(公告)号: US20050171315A1公开(公告)日: 2005-08-04
- 发明人: Katsuyu Wakabayashi , Toshihiko Okamoto , Hiroshi Ando
- 申请人: Katsuyu Wakabayashi , Toshihiko Okamoto , Hiroshi Ando
- 专利权人: KANEKA CORPORATION
- 当前专利权人: KANEKA CORPORATION
- 优先权: JP2002-290538 20021002; JP2003-18065 20030127
- 主分类号: C08K5/09
- IPC分类号: C08K5/09 ; C08L83/04 ; C09K3/10
摘要:
The present invention provides a curable composition which has a high recovery ratio, a high creep resistance, a practical curability and a storage stability. The present invention relates to a curable composition comprising a reactive silicon group-containing organic polymer (A) and a carboxylic acid (B), (I) wherein the composition comprises, as the carboxylic acid (B), a carboxylic acid (C) in which the carbon atom adjacent to the carbonyl group is a quaternary carbon atom; and/or (II) wherein the composition comprises a metal carboxylate (D) formed between a carboxylic acid in which the carbon atom adjacent to the carbonyl group is a quaternary carbon atom and a metal atom of 208 or less in atomic weight.
公开/授权文献
- US07550547B2 Curable composition 公开/授权日:2009-06-23
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