发明申请
- 专利标题: System and method for automated wire bonding
- 专利标题(中): 自动引线接合的系统和方法
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申请号: US10981637申请日: 2004-11-05
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公开(公告)号: US20050173491A1公开(公告)日: 2005-08-11
- 发明人: Byung-Soo Kim , Suk-Chun Jung , Kook-Jin Oh , Young-Han Kwon , Tae-Hyuk Kim
- 申请人: Byung-Soo Kim , Suk-Chun Jung , Kook-Jin Oh , Young-Han Kwon , Tae-Hyuk Kim
- 优先权: KR2004-8352 20040209
- 主分类号: B23K20/00
- IPC分类号: B23K20/00 ; B23K37/00 ; H01L21/60
摘要:
A bonder viewer system may provide an automated procedure for determining a wire bonding sequence based on information provided by a drawing management system. The bonder viewer system may include a bonding sequence decision unit receiving pad and lead coordinate data corresponding to an IC chip, and determining a bonding sequence for bonding wires of the IC chip. The bonder viewer system may further include a turning point check unit and a bonding simulation unit which may provide modifications to the bonding sequence information, which may be based on whether a capillary of a wire bonder is in contact with a pre-bonded wire of the IC chip. The bonder viewer system may also include a standard file generator for generating data based on the bonding sequence information and a translator for preparing the data in a format suitable for a wire bonder.
公开/授权文献
- US07631795B2 System and method for automated wire bonding 公开/授权日:2009-12-15