发明申请
US20050178529A1 Cooling system or electronic apparatus, and electronic apparatus using the same
审中-公开
冷却系统或电子设备及使用其的电子设备
- 专利标题: Cooling system or electronic apparatus, and electronic apparatus using the same
- 专利标题(中): 冷却系统或电子设备及使用其的电子设备
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申请号: US10792721申请日: 2004-03-05
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公开(公告)号: US20050178529A1公开(公告)日: 2005-08-18
- 发明人: Osamu Suzuki
- 申请人: Osamu Suzuki
- 优先权: JP2004-038378 20040216
- 主分类号: H05K7/20
- IPC分类号: H05K7/20 ; F28D15/02 ; F28D15/06 ; F28F7/00 ; F28F13/10 ; G06F1/20 ; H01L23/34 ; H01L23/36 ; H01L23/473
摘要:
An electronic apparatus, such as, personal computers of so-called a desktop type and a notebook type, as well as, a server, etc., having a cooling system being high in cooling efficiency, wherein a CPU 200 in need of cooling is installed within a hosing 100, and the liquid cooling system for cooling the CPU, comprises: a heat-receiving (cooling) jacket 50; a radiator 60; and a circulation pump 70, wherein the heat-receiving (cooling) jacket 50, for transmitting heat generated from a heat-generation element, i.e., the CPU, into a liquid coolant flowing with in an inside thereof, has a heat diffusion plate 90 attached on the lower surface thereof. This heat diffusion plate encloses an operating fluid 94, such as water, within a space, which is hermetically sealed and formed within an inside thereof, and also has heater elements 95, being provided in contact with a portion the operating fluid. To those heater elements 95 are supplied a pulse-like electric power. With this, a portion of the operating fluid repeats forming/extinguishing, to give vibration to the operating fluid, thereby diffusing the heat over the entire of the diffusion plate, as a whole, thereafter the heat is transmitted to the heat-receiving (cooling) jacket. Or, alternatively, it may be connected with a heat radiation fin 300.
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