发明申请
- 专利标题: Microelectronic packages and methods therefor
- 专利标题(中): 微电子封装及其方法
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申请号: US11014439申请日: 2004-12-16
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公开(公告)号: US20050181544A1公开(公告)日: 2005-08-18
- 发明人: Belgacem Haba , Masud Beroz , Ronald Green , Ilyas Mohammed , Stuart Wilson , Wael Zohni , Yoichi Kubota , Jesse Thompson
- 申请人: Belgacem Haba , Masud Beroz , Ronald Green , Ilyas Mohammed , Stuart Wilson , Wael Zohni , Yoichi Kubota , Jesse Thompson
- 申请人地址: US CA San Jose
- 专利权人: Tessera, Inc.
- 当前专利权人: Tessera, Inc.
- 当前专利权人地址: US CA San Jose
- 主分类号: H01L21/44
- IPC分类号: H01L21/44
摘要:
A microelectronic package includes a microelectronic element having faces and contacts and a flexible substrate spaced from and overlying a first face of the microelectronic element. The package also includes a plurality of conductive posts extending from the flexible substrate and projecting away from the first face of the microelectronic element, wherein at least some of the conductive posts are electrically interconnected with the microelectronic element, and a plurality of support elements supporting the flexible substrate over the microelectronic element. The conductive posts are offset from the support elements to facilitate flexure of the substrate and movement of the posts relative to the microelectronic element.
公开/授权文献
- US07176043B2 Microelectronic packages and methods therefor 公开/授权日:2007-02-13