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公开(公告)号:US20050181544A1
公开(公告)日:2005-08-18
申请号:US11014439
申请日:2004-12-16
申请人: Belgacem Haba , Masud Beroz , Ronald Green , Ilyas Mohammed , Stuart Wilson , Wael Zohni , Yoichi Kubota , Jesse Thompson
发明人: Belgacem Haba , Masud Beroz , Ronald Green , Ilyas Mohammed , Stuart Wilson , Wael Zohni , Yoichi Kubota , Jesse Thompson
IPC分类号: H01L21/44
CPC分类号: H01L23/49811 , G01R1/06744 , G01R1/0735 , H01L21/563 , H01L23/4985 , H01L24/12 , H01L24/16 , H01L24/48 , H01L24/73 , H01L2224/0401 , H01L2224/05599 , H01L2224/0603 , H01L2224/131 , H01L2224/13147 , H01L2224/13187 , H01L2224/13188 , H01L2224/1319 , H01L2224/1329 , H01L2224/133 , H01L2224/1357 , H01L2224/136 , H01L2224/1403 , H01L2224/16 , H01L2224/17 , H01L2224/1703 , H01L2224/48091 , H01L2224/73203 , H01L2224/73204 , H01L2224/73257 , H01L2224/73265 , H01L2224/83194 , H01L2224/85399 , H01L2924/00013 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01084 , H01L2924/01322 , H01L2924/014 , H01L2924/09701 , H01L2924/12042 , H01L2924/14 , H01L2924/181 , H01L2924/19041 , H01L2924/3011 , H01L2224/13099 , H01L2224/45099 , H01L2924/00 , H01L2924/00012
摘要: A microelectronic package includes a microelectronic element having faces and contacts and a flexible substrate spaced from and overlying a first face of the microelectronic element. The package also includes a plurality of conductive posts extending from the flexible substrate and projecting away from the first face of the microelectronic element, wherein at least some of the conductive posts are electrically interconnected with the microelectronic element, and a plurality of support elements supporting the flexible substrate over the microelectronic element. The conductive posts are offset from the support elements to facilitate flexure of the substrate and movement of the posts relative to the microelectronic element.
摘要翻译: 微电子封装包括具有面和触点的微电子元件和与微电子元件的第一面间隔开并且覆盖其上的柔性基板。 该封装还包括从柔性基板延伸并从远离微电子元件的第一面突出的多个导电柱,其中至少一些导电柱与微电子元件电互连,以及多个支撑元件 微电子元件上的柔性衬底。 导电柱从支撑元件偏移以便于基板的挠曲和柱相对于微电子元件的移动。
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公开(公告)号:US20070077677A1
公开(公告)日:2007-04-05
申请号:US11607372
申请日:2006-12-01
申请人: Belgacem Haba , Masud Beroz , Ronald Green , IIyas Mohammed , Stuart Wilson , Wael Zohni , Yoichi Kubota , Jesse Thompson
发明人: Belgacem Haba , Masud Beroz , Ronald Green , IIyas Mohammed , Stuart Wilson , Wael Zohni , Yoichi Kubota , Jesse Thompson
IPC分类号: H01L21/00
CPC分类号: H01L23/49811 , G01R1/06744 , G01R1/0735 , H01L21/563 , H01L23/4985 , H01L24/12 , H01L24/16 , H01L24/48 , H01L24/73 , H01L2224/0401 , H01L2224/05599 , H01L2224/0603 , H01L2224/131 , H01L2224/13147 , H01L2224/13187 , H01L2224/13188 , H01L2224/1319 , H01L2224/1329 , H01L2224/133 , H01L2224/1357 , H01L2224/136 , H01L2224/1403 , H01L2224/16 , H01L2224/17 , H01L2224/1703 , H01L2224/48091 , H01L2224/73203 , H01L2224/73204 , H01L2224/73257 , H01L2224/73265 , H01L2224/83194 , H01L2224/85399 , H01L2924/00013 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01084 , H01L2924/01322 , H01L2924/014 , H01L2924/09701 , H01L2924/12042 , H01L2924/14 , H01L2924/181 , H01L2924/19041 , H01L2924/3011 , H01L2224/13099 , H01L2224/45099 , H01L2924/00 , H01L2924/00012
摘要: A microelectronic assembly includes a microelectronic package having a microelectronic element with faces and contacts, a flexible substrate spaced from and overlying a first face of the microelectronic element, and a plurality of conductive posts extending from the flexible substrate and projecting away from the first face of the microelectronic element, at least some of the conductive posts being electrically interconnected with the microelectronic element. The package includes a plurality of support elements disposed between the microelectronic element and the substrate and supporting the flexible substrate over the microelectronic element. At least some of the conductive posts are offset from the support elements. The assembly includes a circuitized substrate having conductive pads confronting the conductive posts of the microelectronic package, whereby the conductive posts are electrically interconnected with the conductive pads.
摘要翻译: 微电子组件包括具有微电子元件的微电子封装,所述微电子元件具有面和触点,与微电子元件的第一面间隔开并覆盖着微电子元件的第一面的柔性基板,以及多个导电柱,其从柔性基板延伸并远离第一面 微电子元件,至少一些导电柱与微电子元件电互连。 所述封装包括设置在所述微电子元件和所述基板之间的多个支撑元件,并且在所述微电子元件上支撑所述柔性基板。 至少一些导电柱从支撑元件偏移。 组件包括具有面对微电子封装的导电柱的导电焊盘的电路化衬底,由此导电柱与导电焊盘电互连。
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公开(公告)号:US07176043B2
公开(公告)日:2007-02-13
申请号:US11014439
申请日:2004-12-16
申请人: Belgacem Haba , Masud Beroz , Ronald Green , Ilyas Mohammed , Stuart E. Wilson , Wael Zohni , Yoichi Kubota , Jesse Burl Thompson
发明人: Belgacem Haba , Masud Beroz , Ronald Green , Ilyas Mohammed , Stuart E. Wilson , Wael Zohni , Yoichi Kubota , Jesse Burl Thompson
IPC分类号: H01L21/66
CPC分类号: H01L23/49811 , G01R1/06744 , G01R1/0735 , H01L21/563 , H01L23/4985 , H01L24/12 , H01L24/16 , H01L24/48 , H01L24/73 , H01L2224/0401 , H01L2224/05599 , H01L2224/0603 , H01L2224/131 , H01L2224/13147 , H01L2224/13187 , H01L2224/13188 , H01L2224/1319 , H01L2224/1329 , H01L2224/133 , H01L2224/1357 , H01L2224/136 , H01L2224/1403 , H01L2224/16 , H01L2224/17 , H01L2224/1703 , H01L2224/48091 , H01L2224/73203 , H01L2224/73204 , H01L2224/73257 , H01L2224/73265 , H01L2224/83194 , H01L2224/85399 , H01L2924/00013 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01084 , H01L2924/01322 , H01L2924/014 , H01L2924/09701 , H01L2924/12042 , H01L2924/14 , H01L2924/181 , H01L2924/19041 , H01L2924/3011 , H01L2224/13099 , H01L2224/45099 , H01L2924/00 , H01L2924/00012
摘要: A microelectronic package includes a microelectronic element having faces and contacts and a flexible substrate spaced from and overlying a first face of the microelectronic element. The package also includes a plurality of conductive posts extending from the flexible substrate and projecting away from the first face of the microelectronic element, wherein at least some of the conductive posts are electrically interconnected with the microelectronic element, and a plurality of support elements supporting the flexible substrate over the microelectronic element. The conductive posts are offset from the support elements to facilitate flexure of the substrate and movement of the posts relative to the microelectronic element.
摘要翻译: 微电子封装包括具有面和触点的微电子元件和与微电子元件的第一面间隔开并且覆盖其上的柔性基板。 该封装还包括从柔性基板延伸并从远离微电子元件的第一面突出的多个导电柱,其中至少一些导电柱与微电子元件电互连,以及多个支撑元件 微电子元件上的柔性衬底。 导电柱从支撑元件偏移以便于基板的挠曲和柱相对于微电子元件的移动。
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公开(公告)号:US07554206B2
公开(公告)日:2009-06-30
申请号:US11607372
申请日:2006-12-01
申请人: Belgacem Haba , Masud Beroz , Ronald Green , Ilyas Mohammed , Stuart E. Wilson , Wael Zohni , Yoichi Kubota , Jesse Burl Thompson
发明人: Belgacem Haba , Masud Beroz , Ronald Green , Ilyas Mohammed , Stuart E. Wilson , Wael Zohni , Yoichi Kubota , Jesse Burl Thompson
IPC分类号: H01L23/52 , H01L23/48 , H01L23/40 , H01L23/485 , H01L23/498
CPC分类号: H01L23/49811 , G01R1/06744 , G01R1/0735 , H01L21/563 , H01L23/4985 , H01L24/12 , H01L24/16 , H01L24/48 , H01L24/73 , H01L2224/0401 , H01L2224/05599 , H01L2224/0603 , H01L2224/131 , H01L2224/13147 , H01L2224/13187 , H01L2224/13188 , H01L2224/1319 , H01L2224/1329 , H01L2224/133 , H01L2224/1357 , H01L2224/136 , H01L2224/1403 , H01L2224/16 , H01L2224/17 , H01L2224/1703 , H01L2224/48091 , H01L2224/73203 , H01L2224/73204 , H01L2224/73257 , H01L2224/73265 , H01L2224/83194 , H01L2224/85399 , H01L2924/00013 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01084 , H01L2924/01322 , H01L2924/014 , H01L2924/09701 , H01L2924/12042 , H01L2924/14 , H01L2924/181 , H01L2924/19041 , H01L2924/3011 , H01L2224/13099 , H01L2224/45099 , H01L2924/00 , H01L2924/00012
摘要: A microelectronic assembly includes a microelectronic package having a microelectronic element with faces and contacts, a flexible substrate spaced from and overlying a first face of the microelectronic element, and a plurality of conductive posts extending from the flexible substrate and projecting away from the first face of the microelectronic element, at least some of the conductive posts being electrically interconnected with the microelectronic element. The package includes a plurality of support elements disposed between the microelectronic element and the substrate and supporting the flexible substrate over the microelectronic element. At least some of the conductive posts are offset from the support elements. The assembly includes a circuitized substrate having conductive pads confronting the conductive posts of the microelectronic package, whereby the conductive posts are electrically interconnected with the conductive pads.
摘要翻译: 微电子组件包括具有微电子元件的微电子封装,所述微电子元件具有面和触点,与微电子元件的第一面间隔开并覆盖所述微电子元件的第一面的柔性基板以及从所述柔性基板延伸并远离所述第一面突出的多个导电柱 微电子元件,至少一些导电柱与微电子元件电互连。 所述封装包括设置在所述微电子元件和所述基板之间的多个支撑元件,并且在所述微电子元件上支撑所述柔性基板。 至少一些导电柱从支撑元件偏移。 组件包括具有面对微电子封装的导电柱的导电焊盘的电路化衬底,由此导电柱与导电焊盘电互连。
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公开(公告)号:US07453157B2
公开(公告)日:2008-11-18
申请号:US11140312
申请日:2005-05-27
申请人: Belgacem Haba , Masud Beroz , Teck-Gyu Kang , Yoichi Kubota , Sridhar Krishnan , John B. Riley, III , Ilyas Mohammed
发明人: Belgacem Haba , Masud Beroz , Teck-Gyu Kang , Yoichi Kubota , Sridhar Krishnan , John B. Riley, III , Ilyas Mohammed
CPC分类号: H01L23/49811 , H01L23/3128 , H01L23/3677 , H01L23/4985 , H01L24/48 , H01L25/105 , H01L2224/16 , H01L2224/16225 , H01L2224/32225 , H01L2224/32245 , H01L2224/48091 , H01L2224/4824 , H01L2224/48247 , H01L2224/73204 , H01L2224/73265 , H01L2225/1023 , H01L2225/1058 , H01L2924/00014 , H01L2924/01004 , H01L2924/01078 , H01L2924/01079 , H01L2924/12042 , H01L2924/15311 , H01L2924/15312 , H01L2924/181 , H01L2924/19041 , H01L2924/3511 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要: A microelectronic package includes a microelectronic element having faces, contacts and an outer perimeter, and a flexible substrate overlying and spaced from a first face of the microelectronic element, an outer region of the flexible substrate extending beyond the outer perimeter of the microelectronic element. The package includes a plurality of etched conductive posts exposed at a surface of the flexible substrate and being electrically interconnected with the microelectronic element, wherein at least one of the conductive posts is disposed in the outer region of the flexible substrate, and a compliant layer disposed between the first face of the microelectronic element and the flexible substrate, wherein the compliant layer overlies the at least one of the conductive posts that is disposed in the outer region of the flexible substrate. The package includes an encapsulating mold material in contact with the microelectronic element and the compliant layer, whereby the encapsulating mold material overlies the outer region of the flexible substrate.
摘要翻译: 微电子封装包括具有面,触点和外周边的微电子元件,以及覆盖并与微电子元件的第一面间隔开的柔性基板,柔性基板的外部区域延伸超出微电子元件的外周边。 所述封装包括多个蚀刻的导电柱,其暴露在所述柔性基板的表面处并与所述微电子元件电互连,其中所述导电柱中的至少一个设置在所述柔性基板的外部区域中,并且设置柔性层 在微电子元件的第一面和柔性基板之间,其中柔性层覆盖设置在柔性基板的外部区域中的至少一个导电柱。 该封装包括与微电子元件和柔性层接触的封装模具材料,由此封装模具材料覆盖在柔性基板的外部区域上。
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公开(公告)号:US08329581B2
公开(公告)日:2012-12-11
申请号:US13183122
申请日:2011-07-14
申请人: Belgacem Haba , Masud Beroz , Teck-Gyu Kang , Yoichi Kubota , Sridhar Krishnan , John B. Riley, III , Ilyas Mohammed
发明人: Belgacem Haba , Masud Beroz , Teck-Gyu Kang , Yoichi Kubota , Sridhar Krishnan , John B. Riley, III , Ilyas Mohammed
IPC分类号: H01L21/44
CPC分类号: H01L23/49811 , H01L23/3128 , H01L23/3677 , H01L23/4985 , H01L24/48 , H01L25/105 , H01L2224/16 , H01L2224/16225 , H01L2224/32225 , H01L2224/32245 , H01L2224/48091 , H01L2224/4824 , H01L2224/48247 , H01L2224/73204 , H01L2224/73265 , H01L2225/1023 , H01L2225/1058 , H01L2924/00014 , H01L2924/01004 , H01L2924/01078 , H01L2924/01079 , H01L2924/12042 , H01L2924/15311 , H01L2924/15312 , H01L2924/181 , H01L2924/19041 , H01L2924/3511 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要: A microelectronic package includes a microelectronic element having faces and contacts, the microelectronic element having an outer perimeter, and a substrate overlying and spaced from a first face of the microelectronic element, whereby an outer region of the substrate extends beyond the outer perimeter of the microelectronic element. The microelectronic package includes a plurality of etched conductive posts exposed at a surface of the substrate and being electrically interconnected with the microelectronic element, whereby at least one of the etched conductive posts is disposed in the outer region of the substrate. The package includes an encapsulating mold material in contact with the microelectronic element and overlying the outer region of the substrate, the encapsulating mold material extending outside of the etched conductive posts for defining an outermost edge of the microelectronic package.
摘要翻译: 微电子封装包括具有面和触点的微电子元件,微电子元件具有外周边,以及覆盖并与微电子元件的第一面间隔开的衬底,由此衬底的外部区域延伸超过微电子器件的外周边 元件。 微电子封装包括多个蚀刻的导电柱,暴露在衬底的表面并与微电子元件电互连,由此至少一个蚀刻的导电柱设置在衬底的外部区域中。 封装包括与微电子元件接触并覆盖衬底的外部区域的封装模具材料,该封装模具材料延伸到蚀刻的导电柱的外部,用于限定微电子封装的最外边缘。
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公开(公告)号:US07999397B2
公开(公告)日:2011-08-16
申请号:US12789683
申请日:2010-05-28
申请人: Belgacem Haba , Masud Beroz , Teck-Gyu Kang , Yoichi Kubota , Sridhar Krishnan , John B. Riley, III , Ilyas Mohammed
发明人: Belgacem Haba , Masud Beroz , Teck-Gyu Kang , Yoichi Kubota , Sridhar Krishnan , John B. Riley, III , Ilyas Mohammed
CPC分类号: H01L23/49811 , H01L23/3128 , H01L23/3677 , H01L23/4985 , H01L24/48 , H01L25/105 , H01L2224/16 , H01L2224/16225 , H01L2224/32225 , H01L2224/32245 , H01L2224/48091 , H01L2224/4824 , H01L2224/48247 , H01L2224/73204 , H01L2224/73265 , H01L2225/1023 , H01L2225/1058 , H01L2924/00014 , H01L2924/01004 , H01L2924/01078 , H01L2924/01079 , H01L2924/12042 , H01L2924/15311 , H01L2924/15312 , H01L2924/181 , H01L2924/19041 , H01L2924/3511 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要: A microelectronic package includes a microelectronic element having faces and contacts, the microelectronic element having an outer perimeter, and a substrate overlying and spaced from a first face of the microelectronic element, whereby an outer region of the substrate extends beyond the outer perimeter of the microelectronic element. The microelectronic package includes a plurality of etched conductive posts exposed at a surface of the substrate and being electrically interconnected with the microelectronic element, whereby at least one of the etched conductive posts is disposed in the outer region of the substrate. The package includes an encapsulating mold material in contact with the microelectronic element and overlying the outer region of the substrate, the encapsulating mold material extending outside of the etched conductive posts for defining an outermost edge of the microelectronic package.
摘要翻译: 微电子封装包括具有面和触点的微电子元件,微电子元件具有外周边,以及覆盖并与微电子元件的第一面间隔开的衬底,由此衬底的外部区域延伸超出微电子器件的外周边 元件。 微电子封装包括多个蚀刻的导电柱,暴露在衬底的表面并与微电子元件电互连,由此至少一个蚀刻的导电柱设置在衬底的外部区域中。 封装包括与微电子元件接触并覆盖衬底的外部区域的封装模具材料,该封装模具材料延伸到蚀刻的导电柱的外部,用于限定微电子封装的最外边缘。
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公开(公告)号:US20070205496A1
公开(公告)日:2007-09-06
申请号:US11799771
申请日:2007-05-03
申请人: Belgacem Haba , Masud Beroz , Teck-Gyu Kang , Yoichi Kubota , Sridhar Krishnan , John Riley , Ilyas Mohammed
发明人: Belgacem Haba , Masud Beroz , Teck-Gyu Kang , Yoichi Kubota , Sridhar Krishnan , John Riley , Ilyas Mohammed
IPC分类号: H01L23/02
CPC分类号: H01L23/49811 , H01L23/3128 , H01L23/3677 , H01L23/4985 , H01L24/48 , H01L25/105 , H01L2224/16 , H01L2224/16225 , H01L2224/32225 , H01L2224/32245 , H01L2224/48091 , H01L2224/4824 , H01L2224/48247 , H01L2224/73204 , H01L2224/73265 , H01L2225/1023 , H01L2225/1058 , H01L2924/00014 , H01L2924/01004 , H01L2924/01078 , H01L2924/01079 , H01L2924/12042 , H01L2924/15311 , H01L2924/15312 , H01L2924/181 , H01L2924/19041 , H01L2924/3511 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要: A microelectronic package includes a microelectronic element having faces and contacts, the microelectronic element having an outer perimeter, and a substrate overlying and spaced from a first face of the microelectronic element, whereby an outer region of the substrate extends beyond the outer perimeter of the microelectronic element. The microelectronic package includes a plurality of etched conductive posts exposed at a surface of the substrate and being electrically interconnected with the microelectronic element, whereby at least one of the etched conductive posts is disposed in the outer region of the substrate. The package includes an encapsulating mold material in contact with the microelectronic element and overlying the outer region of the substrate, the encapsulating mold material extending outside of the etched conductive posts for defining an outermost edge of the microelectronic package.
摘要翻译: 微电子封装包括具有面和触点的微电子元件,微电子元件具有外周边,以及覆盖并与微电子元件的第一面间隔开的衬底,由此衬底的外部区域延伸超过微电子器件的外周边 元件。 微电子封装包括多个蚀刻的导电柱,暴露在衬底的表面并与微电子元件电互连,由此至少一个蚀刻的导电柱设置在衬底的外部区域中。 封装包括与微电子元件接触并覆盖衬底的外部区域的封装模具材料,该封装模具材料延伸到蚀刻的导电柱的外部,用于限定微电子封装的最外边缘。
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公开(公告)号:US20050285246A1
公开(公告)日:2005-12-29
申请号:US11140312
申请日:2005-05-27
申请人: Belgacem Haba , Masud Beroz , Teck-Gyu Kang , Yoichi Kubota , Sridhar Krishnan , John Riley , Ilyas Mohammed
发明人: Belgacem Haba , Masud Beroz , Teck-Gyu Kang , Yoichi Kubota , Sridhar Krishnan , John Riley , Ilyas Mohammed
IPC分类号: H01L23/02 , H01L23/31 , H01L23/367 , H01L23/498 , H01L25/10
CPC分类号: H01L23/49811 , H01L23/3128 , H01L23/3677 , H01L23/4985 , H01L24/48 , H01L25/105 , H01L2224/16 , H01L2224/16225 , H01L2224/32225 , H01L2224/32245 , H01L2224/48091 , H01L2224/4824 , H01L2224/48247 , H01L2224/73204 , H01L2224/73265 , H01L2225/1023 , H01L2225/1058 , H01L2924/00014 , H01L2924/01004 , H01L2924/01078 , H01L2924/01079 , H01L2924/12042 , H01L2924/15311 , H01L2924/15312 , H01L2924/181 , H01L2924/19041 , H01L2924/3511 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要: A microelectronic package includes a microelectronic element having faces, contacts and an outer perimeter, and a flexible substrate overlying and spaced from a first face of the microelectronic element, an outer region of the flexible substrate extending beyond the outer perimeter of the microelectronic element. The package includes a plurality of conductive posts exposed at a surface of the flexible substrate and being electrically interconnected with the microelectronic element, wherein at least one of the conductive posts is disposed in the outer region of the flexible substrate, and a compliant layer disposed between the first face of the microelectronic element and the flexible substrate, wherein the compliant layer overlies the at least one of the conductive posts that is disposed in the outer region of the flexible substrate. The package includes a support element in contact with the microelectronic element and the compliant layer, whereby the support element overlies the outer region of the flexible substrate.
摘要翻译: 微电子封装包括具有面,触点和外周边的微电子元件,以及覆盖并与微电子元件的第一面间隔开的柔性基板,柔性基板的外部区域延伸超出微电子元件的外周边。 所述封装包括暴露在所述柔性基板的表面处并与所述微电子元件电互连的多个导电柱,其中至少一个所述导电柱设置在所述柔性基板的外部区域中,并且柔性层设置在所述柔性基板之间 微电子元件和柔性基板的第一面,其中柔性层覆盖设置在柔性基板的外部区域中的至少一个导电柱。 该封装包括与微电子元件和柔性层接触的支撑元件,由此支撑元件覆盖在柔性基板的外部区域上。
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公开(公告)号:US20110269272A1
公开(公告)日:2011-11-03
申请号:US13183122
申请日:2011-07-14
申请人: Belgacem Haba , Masud Beroz , Teck-Gyu Kang , Yoichi Kubota , Sridhar Krishnan , John B. Riley, III , Ilyas Mohammed
发明人: Belgacem Haba , Masud Beroz , Teck-Gyu Kang , Yoichi Kubota , Sridhar Krishnan , John B. Riley, III , Ilyas Mohammed
IPC分类号: H01L21/56
CPC分类号: H01L23/49811 , H01L23/3128 , H01L23/3677 , H01L23/4985 , H01L24/48 , H01L25/105 , H01L2224/16 , H01L2224/16225 , H01L2224/32225 , H01L2224/32245 , H01L2224/48091 , H01L2224/4824 , H01L2224/48247 , H01L2224/73204 , H01L2224/73265 , H01L2225/1023 , H01L2225/1058 , H01L2924/00014 , H01L2924/01004 , H01L2924/01078 , H01L2924/01079 , H01L2924/12042 , H01L2924/15311 , H01L2924/15312 , H01L2924/181 , H01L2924/19041 , H01L2924/3511 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要: A microelectronic package includes a microelectronic element having faces and contacts, the microelectronic element having an outer perimeter, and a substrate overlying and spaced from a first face of the microelectronic element, whereby an outer region of the substrate extends beyond the outer perimeter of the microelectronic element. The microelectronic package includes a plurality of etched conductive posts exposed at a surface of the substrate and being electrically interconnected with the microelectronic element, whereby at least one of the etched conductive posts is disposed in the outer region of the substrate. The package includes an encapsulating mold material in contact with the microelectronic element and overlying the outer region of the substrate, the encapsulating mold material extending outside of the etched conductive posts for defining an outermost edge of the microelectronic package.
摘要翻译: 微电子封装包括具有面和触点的微电子元件,微电子元件具有外周边,以及覆盖并与微电子元件的第一面间隔开的衬底,由此衬底的外部区域延伸超过微电子器件的外周边 元件。 微电子封装包括多个蚀刻的导电柱,暴露在衬底的表面并与微电子元件电互连,由此至少一个蚀刻的导电柱设置在衬底的外部区域中。 封装包括与微电子元件接触并覆盖衬底的外部区域的封装模具材料,该封装模具材料延伸到蚀刻的导电柱的外部,用于限定微电子封装的最外边缘。
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