A form assembly is suitable for mailing and includes a front sheet comprising a fold line that separates a first section and a second section of the front sheet. Each section defines a foldable flap along the fold line. Adhesive material is disposed on the back inner face of the front sheet. The form assembly also includes a back sheet comprising at least one die-cut. The die-cut substantially conforms to the second section and a receiving area of the front sheet. Adhesive release material is disposed on the front inner face of the back sheet. Once the die-cut is removed, one of the foldable flaps can be folded along the fold line and adhesively bound to a receiving area of the front sheet that is adjacent to the fold line, thereby resulting in a multi-ply form having a substantially uniform thickness.