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发明申请
US20050189522A1 Method of forming an electronic device having high thermal conductivity and dielectric strength 审中-公开
形成具有高导热性和介电强度的电子器件的方法

Method of forming an electronic device having high thermal conductivity and dielectric strength
摘要：
A polymer composition having high thermal conductivity and dielectric strength is provided. The polymer composition comprises a base polymer matrix and a thermally-conductive, electrically-insulating material. A reinforcing material such as glass can be added to the composition. The polymer composition can be molded into packaging assemblies for electronic devices such as capacitors, transistors, and resistors.
摘要（中）：

提供了具有高导热性和介电强度的聚合物组合物。 聚合物组合物包含基础聚合物基质和导热的电绝缘材料。 可以在组合物中添加玻璃等增强材料。 聚合物组合物可以模制成用于诸如电容器，晶体管和电阻器的电子器件的包装组件。

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