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    MOLDING COMPOSITION FOR FORMING IN-MOLD METALLIZED POLYMER COMPONENTS
    2.
    发明申请
    MOLDING COMPOSITION FOR FORMING IN-MOLD METALLIZED POLYMER COMPONENTS 失效
    用于形成模内金属化聚合物组分的模塑组合物

    公开(公告)号：US20070264513A1

    公开(公告)日：2007-11-15

    申请号：US11782061

    申请日：2007-07-24

    申请人： Kevin McCullough

    发明人： Kevin McCullough

    IPC分类号： B32B15/08 ,  B29B9/00

    CPC分类号： B29C45/0013 ,  B29C2045/0015 ,  B29K2055/02 ,  B29K2069/00 ,  B29K2081/04 ,  B29K2705/00 ,  B29K2705/06 ,  B29L2009/003 ,  Y10T428/31678 ,  Y10T428/31692 ,  Y10T428/31696 ,  Y10T428/31699 ,  Y10T428/31935

    摘要： A method is provided for forming a feedstock material for use in net shape molded component that includes an integral metallized coating or layer on the exterior surface thereof. The feedstock includes a carefully matched mixture of polymer resin and a metallic alloy that is suitable for use in a molding method that includes melting and injecting the material into a mold cavity under pressure. Due to the differential in material viscosities, the metal tends to migrate to the outer surface of the molded part when placed under pressure, ultimately creating a net shape molded part having a polymer core with a metallic layer at the exterior surfaces thereof.

    摘要翻译： 提供一种用于形成用于净形状模制部件的原料材料的方法，其中包括在其外表面上的整体金属化涂层或层。 原料包括聚合物树脂和金属合金的精心匹配的混合物，其适用于包括在压力下将材料熔融和注入模腔中的模制方法中使用。 由于材料粘度的差异，当放置在压力下时，金属倾向于迁移到模制部件的外表面，最终形成具有在其外表面处具有金属层的聚合物芯的网状模制部件。

    IONIC FLOW GENERATOR FOR THERMAL MANAGEMENT
    5.
    发明申请
    IONIC FLOW GENERATOR FOR THERMAL MANAGEMENT 有权
    用于热管理的离子流量发生器

    公开(公告)号：US20060250746A1

    公开(公告)日：2006-11-09

    申请号：US11381571

    申请日：2006-05-04

    申请人： Kevin McCullough

    发明人： Kevin McCullough

    IPC分类号： B05B5/03

    CPC分类号： H01T23/00

    摘要： The apparatus for generating ionic flow of media includes a DC voltage supply having a positive terminal and a negative terminal with a collector connected to the negative terminal of the direct current voltage supply. The collector has a substantially tubular configuration with a rear and front section with inwardly tapering frusto-conical section therebetween. An emitter pin is connected to the positive terminal of the direct current voltage supply with the majority of the tip being located within the frusto-conical section of the collector. Alternatively, the front section of the collector may be made of a dielectric material, such as plastic. As a result, fluid flow, such as air flow, is generated from the input port of the rear section of the collector, through the frusto-conical section of the collector and out the output port of the front section of the collector.

    摘要翻译： 用于产生介质离子流的装置包括具有正极端子和负极端子的直流电压源，集电极连接到直流电压源的负极端子。 收集器具有基本上管状的构造，其具有后部和前部，其间具有向内渐缩的截头圆锥形截面。 发射极引脚连接到直流电压源的正极端子，大部分尖端位于集电极的截头圆锥形部分内。 或者，收集器的前部可由介电材料制成，例如塑料。 结果，从收集器的后部的输入端口通过收集器的截头圆锥形部分并且从收集器的前部的输出端口出来，产生诸如空气流的流体流。

    MOLDABLE PELTIER THERMAL TRANSFER DEVICE AND METHOD OF MANUFACTURING SAME
    6.
    发明申请
    MOLDABLE PELTIER THERMAL TRANSFER DEVICE AND METHOD OF MANUFACTURING SAME 审中-公开
    可弯曲式传热装置及其制造方法

    公开(公告)号：US20060243316A1

    公开(公告)日：2006-11-02

    申请号：US11380300

    申请日：2006-04-26

    申请人： Kevin McCullough

    发明人： Kevin McCullough

    IPC分类号： H01L35/30

    CPC分类号： H01L35/32 ,  H01L23/38 ,  H01L35/26 ,  H01L35/34 ,  H01L2924/0002 ,  H01L2924/00

    摘要： A thermal transfer device includes a body member having a base material of a first semiconductor material of a first type with a filler material dispersed therein of a second semiconductor material of a second type. Electrodes are attached on sides of the body member and electrical current is run therethrough to create thermal flow using the Peltier effect. The device is formed by injection molding and the like and the filler is introduced into the base by, for example, extrusion or pultrusion processes.

    摘要翻译： 热转印装置包括：本体构件，其具有第一类型的第一半导体材料的基材，其中分散有第二类型的第二半导体材料的填充材料。 电极附着在主体部​​件的侧面，电流穿过其中，以利用珀耳帖效应产生热流。 该装置通过注射成型等形成，并且通过例如挤出或拉挤成型方法将填料引入基底。

    METHOD OF TWO SHOT MOLD METALLIZING OF POLYMER COMPONENTS
    7.
    发明申请
    METHOD OF TWO SHOT MOLD METALLIZING OF POLYMER COMPONENTS 审中-公开
    聚合物组分的两种模制金属化方法

    公开(公告)号：US20060231231A1

    公开(公告)日：2006-10-19

    申请号：US11379295

    申请日：2006-04-19

    申请人： Kevin McCULLOUGH

    发明人： Kevin McCULLOUGH

    IPC分类号： B22D17/08 ,  B22D19/00 ,  B22D19/08

    CPC分类号： B22D19/08 ,  B22D19/16 ,  B29C45/16 ,  B29C2045/1696

    摘要： A component is provided that is net shape molded using a polymer to form the core structure and which includes an integrally formed metallized coating or layer on at least one of the exterior surfaces thereof. The process of forming the component includes two-shot molding process wherein a thin layer of metal or the base polymer component is molded, the mold is adjusted and then the remainder of the part is molded. Alternately, an insert molding process may be employed such that after the polymer base part is formed, it may be placed into a mold cavity that is slightly larger than the entire part, thereby allowing substantially the entire exterior surface of the part to be over molded with a molten metal.

    摘要翻译： 提供了使用聚合物成型以形成芯结构并且在其至少一个外表面上包括整体形成的金属化涂层或层的网状部件。 形成部件的方法包括双模成型工艺，其中模制金属或基础聚合物组分的薄层，模具被调节，然后其余部分被模制。 或者，可以采用插入成型工艺，使得在形成聚合物基底部件之后，可以将其放置在比整个部分稍大的模具腔中，从而基本上使部件的整个外表面过度模制 与熔融金属。

    Thermally conductive electronic connector having molded housing
    10.
    发明申请
    Thermally conductive electronic connector having molded housing 有权
    具有模制外壳的导热电子连接器

    公开(公告)号：US20050095901A1

    公开(公告)日：2005-05-05

    申请号：US11011996

    申请日：2004-12-14

    申请人： James Miller ,  E. Sagal ,  Kevin McCullough

    发明人： James Miller ,  E. Sagal ,  Kevin McCullough

    IPC分类号： G02B6/38 ,  G02B6/42 ,  H05K7/20 ,  H05K9/00 ,  H01R13/00

    CPC分类号： H05K9/0083 ,  G02B6/3814 ,  G02B6/4201 ,  G02B6/4246 ,  G02B6/4272 ,  G02B6/4277 ,  G02B6/4284 ,  H05K7/20

    摘要： An electronic connector having a housing containing a circuit board with a heat-generating component, such as a photodiode or laser, is provided. The housing is molded over the circuit board and heat-generating component. The housing is made from a moldable, thermally conductive polymer composition containing a base polymer and thermally conductive filler material. Liquid crystal polymers can be used as the base polymer, and boron nitride particles and carbon fibers can be used as the thermally conductive filler materials. In one embodiment, the thermally conductive polymer composition includes 30 to 60% of a base polymer, 25% to 50% of a first thermally conductive filler material, and 10 to 25% of a second thermally conductive filler material. The molded housing is capable of dissipating heat from the heat-generating component. A method for making the electronic connector is also provided.

    摘要翻译： 提供一种电子连接器，其具有包含具有诸如光电二极管或激光器之类的发热部件的电路板的壳体。 外壳在电路板和发热部件上模制。 壳体由含有基础聚合物和导热填料的可模制的导热聚合物组合物制成。 可以使用液晶聚合物作为基础聚合物，可以使用氮化硼颗粒和碳纤维作为导热填料。 在一个实施方案中，导热聚合物组合物包含30至60％的基础聚合物，25％至50％的第一导热填料材料和10至25％的第二导热填料材料。 模制外壳能够散发来自发热部件的热量。 还提供了制造电子连接器的方法。