- 专利标题： Packaged die on PCB with heat sink encapsulant and methods
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申请号： US11053082申请日： 2005-02-07
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公开(公告)号： US20050189646A1公开(公告)日： 2005-09-01
- 发明人: Salman Akram , James Wark
- 申请人： Salman Akram , James Wark
- 主分类号： H01L21/60
- IPC分类号： H01L21/60 ; H01L23/31 ; H01L23/42 ; H01L23/433 ; H01L23/34
摘要：
An apparatus and a method for providing a heat sink on an upper surface of a semiconductor chip by placing a heat-dissipating material thereon which forms a portion of a glob top. The apparatus comprises a semiconductor chip attached to and in electrical communication with a substrate. A barrier glob top material is applied to the edges of the semiconductor chip on the surface (“opposing surface”) opposite the surface attached to the substrate to form a wall around a periphery of the opposing surface of the semiconductor chip wherein the barrier glob top material also extends to contact and adhere to the substrate. The wall around the periphery of the opposing surface of the semiconductor chip forms a recess. A heat-dissipating glob top material is disposed within the recess to contact the opposing surface of the semiconductor chip.
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