发明申请
- 专利标题： Semiconductor packaging techniques for use with non-ceramic packages
- 专利标题（中）： 用于非陶瓷封装的半导体封装技术
-
申请号： US10788162申请日： 2004-02-26
-
公开(公告)号： US20050191793A1公开(公告)日： 2005-09-01
- 发明人: John Brennan , Joseph Freund , Curtis Miller , Richard Shanaman
- 申请人： John Brennan , Joseph Freund , Curtis Miller , Richard Shanaman
- 主分类号： H01L21/44
- IPC分类号： H01L21/44 ; H01L21/48 ; H01L21/50 ; H01L23/047 ; H01L23/31 ; H01L23/433 ; H01L23/495
摘要：
A method for attaching at least one IC die to a non-ceramic IC package including a leadframe and a base, the IC package being configured for receiving the at least one IC die, includes attaching the IC die to an upper surface of a thermal carrier in a manner which facilitates thermal transfer between the die and the carrier. The method further includes attaching the thermal carrier having the IC die attached thereto to an upper surface of the base of the IC package. In this manner, one or more IC dies may be attached to a standard plastic IC package without a significant impact on thermal transfer in the device and at a significant cost savings compared to ceramic IC packages.
公开/授权文献
信息查询
IPC分类:
