发明申请
US20050194675A1 Capacitor-related systems for addressing package/motherboard resonance
有权
用于寻址封装/主板谐振的电容器相关系统
- 专利标题: Capacitor-related systems for addressing package/motherboard resonance
- 专利标题(中): 用于寻址封装/主板谐振的电容器相关系统
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申请号: US11103939申请日: 2005-04-12
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公开(公告)号: US20050194675A1公开(公告)日: 2005-09-08
- 发明人: Jennifer Hester , Yuan-Liang Li , Michael Desmith , David Figueroa , Dong Zhong
- 申请人: Jennifer Hester , Yuan-Liang Li , Michael Desmith , David Figueroa , Dong Zhong
- 主分类号: H01G4/38
- IPC分类号: H01G4/38 ; H01L23/498 ; H01L23/64 ; H05K1/02 ; H05K1/11 ; H01L23/48
摘要:
According to some embodiments, a device includes a first conductive plane electrically coupled to a first terminal associated with a first polarity and a second terminal associated with the first polarity, a second conductive plane electrically coupled to a third terminal associated with a second polarity, and a dielectric disposed between the first conductive plane and the second conductive plane. A first capacitance is present between the first terminal and the third terminal, a second capacitance is present between the second terminal and the third terminal, and the first capacitance and the second capacitance may be substantially dissimilar.
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