发明申请
US20050200376A1 Integrated circuit (IC) test assembly including phase change material for stabilizing temperature during stress testing of integrated circuits and method thereof
失效
集成电路（IC）测试组件，包括用于在集成电路的应力测试期间稳定温度的相变材料及其方法
- 专利标题： Integrated circuit (IC) test assembly including phase change material for stabilizing temperature during stress testing of integrated circuits and method thereof
- 专利标题（中）： 集成电路（IC）测试组件，包括用于在集成电路的应力测试期间稳定温度的相变材料及其方法
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申请号： US10883487申请日： 2004-07-01
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公开(公告)号： US20050200376A1公开(公告)日： 2005-09-15
- 发明人: Pak Hong Yee , Wuu Yean Tay
- 申请人： Pak Hong Yee , Wuu Yean Tay
- 优先权： SG200,401,161-S 20040309
- 主分类号： G01R31/02
- IPC分类号： G01R31/02 ; G01R31/26
摘要：
A testing apparatus and method for testing integrated circuits is disclosed wherein a device under test is continuously maintained at a desired set point temperature by an included thermal body. The thermal body has an enclosed phase change material which provides latent heat to the device under test such that there is negligible temperature variation realized by integrated circuits being tested.
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