利索-全球专利检索

  1. 登录
  2. 注册
发明申请
US20050205836A1 Grinding abrasive grains, abrasive, abrasive solution, abrasive solution preparation method, grinding method, and semiconductor device fabrication method 有权
研磨磨料，研磨剂，磨料溶液，研磨剂制备方法，研磨方法和半导体器件制造方法

Grinding abrasive grains, abrasive, abrasive solution, abrasive solution preparation method, grinding method, and semiconductor device fabrication method
摘要：
Abrasive grains have mainly grains with a roundness of 0.50 or more and 0.75 or less, where the roundness is defined as the ratio of the circumference of a circle having the same area as that of a grain to the perimeter of that grain. An abrasive has the abrasive grains and at least one of an oxidizer, an oxide solution, an abrasive grain dispersion agent and a basic compound. An abrasive solution has the abrasive grains and water or hydrophilic substance.
摘要（中）：

磨粒主要是圆度为0.50以上且0.75以下的圆形，其中圆度被定义为具有与颗粒相同面积的圆的周长与该颗粒的周长的比率。 磨料具有磨粒和氧化剂，氧化物溶液，磨粒分散剂和碱性化合物中的至少一种。 磨料溶液具有磨粒和水或亲水性物质。

公开/授权文献
信息查询
Global Dossier Espacenet
0/0