公开(公告)号：US12234382B2

公开(公告)日：2025-02-25

申请号：US17384940

申请日：2021-07-26

Applicant: CMC Materials, Inc.

Inventor： Hsin-Yen Wu ,  Jin-Hao Jhang ,  Cheng-Yuan Ko

IPC: C09G1/02 ,  C09K3/14 ,  C09K13/00 ,  H01L21/321 ,  H01L21/768

Abstract: A chemical mechanical polishing composition for polishing tungsten or molybdenum comprises, consists essentially of, or consists of a water based liquid carrier, abrasive particles dispersed in the liquid carrier, an amino acid selected from the group consisting of arginine, histidine, cysteine, lysine, and mixtures thereof, an anionic polymer or an anionic surfactant, and an optional amino acid surfactant. A method for chemical mechanical polishing a substrate including a tungsten layer or a molybdenum layer includes contacting the substrate with the above described polishing composition, moving the polishing composition relative to the substrate, and abrading the substrate to remove a portion of the tungsten layer or the molybdenum layer from the substrate and thereby polish the substrate.

公开(公告)号：US20250034430A1

公开(公告)日：2025-01-30

申请号：US18713122

申请日：2022-11-30

Applicant: ANJI MICROELECTRONICS (SHANGHAI) CO.,LTD

Inventor： Xingping WANG ,  Pengyu Xu ,  Changzheng JIA ,  Fengru LIU ,  Shoutian LI ,  Zhan CHEN

IPC: C09G1/02 ,  C09K3/14

Abstract: The present disclosure provides a method for preparing an organic-inorganic nanocomposite particle dispersion, comprising: preparing a negatively charged organic-inorganic nanocomposite particle dispersion: adding positively charged inorganic nanoparticles to an anionic organic polymer solution, stirring thoroughly, dispersing uniformly, and obtaining a negatively charged organic-inorganic nanocomposite particle dispersion; preparing a positively charged organic-inorganic nanocomposite particle dispersion: adding a negatively charged organic polymer inorganic metal oxide composite dispersion to a cationic organic polymer solution, stirring thoroughly, and dispersing uniformly to obtain a positively charged organic polymer inorganic nanocomposite particle dispersion; repeating step (1) and (2) alternately to obtain a dispersion of negatively charged and positively charged organic-inorganic nanocomposites by adjusting the number of step (1) and (2), respectively. Through the above methods, effective control of CMP polishing fluid performance can be achieved.

公开(公告)号：US20250032835A1

公开(公告)日：2025-01-30

申请号：US18911769

申请日：2024-10-10

Applicant: THE CHEMOURS COMPANY FC, LLC

Inventor： MARIO JOSEPH NAPPA

IPC: A62D1/00 ,  C07C17/25 ,  C08J9/14 ,  C09K3/00 ,  C09K3/14 ,  C09K3/30 ,  C09K5/04 ,  C09K21/08 ,  C09K23/00 ,  C11D7/30 ,  C11D7/50 ,  F25B39/02 ,  F28C3/08 ,  H01B3/56

Abstract: The present disclosure relates to compositions comprising 2,3,3,3-tetrafluoropropene that may be useful as heat transfer compositions, aerosol propellants, foaming agents, blowing agents, solvents, cleaning agents, carrier fluids, displacement drying agents, buffing abrasion agents, polymerization media, expansion agents for polyolefins and polyurethane, gaseous dielectrics, extinguishing agents, and fire suppression agents in liquid or gaseous form. Additionally, the present disclosure relates to compositions comprising 1,1,2,3-tetrachloropropene, 2-chloro-3,3,3-trifluoropropene, or 2-chloro-1,1,1,2-tetrafluoropropane, which may be useful in processes to produce 2,3,3,3-tetrafluoropropene.

公开(公告)号：US12173215B2

公开(公告)日：2024-12-24

申请号：US17570386

申请日：2022-01-07

Applicant: KOREA INSTITUTE OF SCIENCE AND TECHNOLOGY

Inventor： Chong Min Koo ,  Tae Gon Oh ,  Seung Jun Lee ,  Seon Joon Kim ,  Soon Man Hong ,  Seung Sang Hwang ,  Albert Lee

IPC: C09K13/06 ,  C01B32/90 ,  C01B32/921 ,  C08K3/14 ,  C09G1/00 ,  C09G1/02 ,  C09G1/06 ,  C09K3/14 ,  C09K13/00 ,  C09K13/04 ,  C09K13/08 ,  C11D3/04 ,  C11D3/24 ,  C11D7/08 ,  C11D7/10 ,  C11D7/28

Abstract: The present invention relates to an etching composition and a method of producing a MXene. The etching composition of the present invention can stably and quickly produce a MXene at high temperature. The etching composition of the present invention can produce a MXene in high yield. The etching composition of the present invention can easily produce various types of MXenes. A method using the etching composition of the present invention can produce a MXene having excellent electrochemical and mechanical properties.

公开(公告)号：US12173193B2

公开(公告)日：2024-12-24

申请号：US16765040

申请日：2018-10-18

Applicant: SHIN-ETSU CHEMICAL CO., LTD.

Inventor： Mitsuhito Takahashi

IPC: C09G1/02 ,  B24B37/04 ,  C03C19/00 ,  C09K3/14

Abstract: A polishing agent for a synthetic quartz glass substrate. The polishing agent contains wet ceria particles and non-spherical silica particles. The wet ceria particles have an average primary particle diameter of 30 nm to 50 nm. The non-spherical silica particles have an average primary particle diameter of 80 nm to 120 nm. This provides a polishing agent for a synthetic quartz glass substrate, the polishing agent having high polishing rate and being capable of sufficiently reducing generation of defects due to polishing.

公开(公告)号：US20240368444A1

公开(公告)日：2024-11-07

申请号：US18311448

申请日：2023-05-03

Applicant: Morehouse School of Medicine ,  DEVMAR PRODUCTS, LLC

Inventor： Ricky L. CHRISTIAN ,  James W. LILLARD, JR. ,  Sharon W. REYNOLDS

IPC: C09K3/14

Abstract: A method for formulating a liquid loading and coating composition for anti-slipping that contains the step of coating a superheated granular absorbent material with a coating agent to produce a coated absorbent material and mixing the coated absorbent material with an absorbable agent, wherein the coated absorbent material absorbs the absorbable agent to form the liquid loading and coating composition. Liquid loading and coating compositions that can absorb liquids in many applications, including fire retardant, are also disclosed.

公开(公告)号：US12104087B2

公开(公告)日：2024-10-01

申请号：US17775887

申请日：2020-10-12

Applicant: JSR CORPORATION

Inventor： Yuuya Yamada ,  Pengyu Wang ,  Norihiko Sugie ,  Yasutaka Kamei

IPC: C09G1/02 ,  C09K3/14 ,  C09K13/00 ,  H01L21/321 ,  H01L21/768

CPC classification number: C09G1/02 ,  C09K3/1436 ,  C09K13/00 ,  H01L21/3212 ,  H01L21/7684

Abstract: Provided are a chemical-mechanical polishing composition and a chemical-mechanical polishing method capable of polishing a semiconductor substrate containing a conductive metal such as tungsten or cobalt flatly and at high speed as well as reducing surface defects after polishing. The composition for chemical-mechanical polishing contains (A) silica particles having a functional group represented by general formula (1) and (B) a silane compound. —COO-M+ . . . (1) (M+ represents a monovalent cation.)

公开(公告)号：US20240318038A1

公开(公告)日：2024-09-26

申请号：US18610982

申请日：2024-03-20

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sanghwa Lee ,  Yearin Byun ,  Inkwon Kim

IPC: C09G1/02 ,  C07F5/00 ,  C09K3/14 ,  H01L21/3105 ,  H01L21/321

CPC classification number: C09G1/02 ,  C07F5/003 ,  C09K3/1409 ,  H01L21/31053 ,  H01L21/3212

Abstract: Provided are a method of manufacturing a chemical mechanical polishing slurry and a method of manufacturing a semiconductor device using the same. The method of manufacturing a chemical mechanical polishing slurry includes mixing a first precursor including cerium and a second precursor in an aqueous solution, forming nanoclusters including cerium by a reaction (e.g., a synthesis reaction) between the first precursor and the second precursor, and forming a chemical mechanical polishing slurry by mixing at least one of a pH adjuster, deionized water, an inhibitor, a booster, and a dispersant with the nanoclusters.

公开(公告)号：US20240309254A1

公开(公告)日：2024-09-19

申请号：US18671449

申请日：2024-05-22

Applicant: SAINT-GOBAIN ABRASIVES, INC. ,  SAINT-GOBAIN ABRASIFS

Inventor： Alexander NASHED ,  Amandine MARTIN ,  Peter JANECZEK ,  Simone SCHAEFER ,  Nilanjan SARANGI ,  Guangyong LIN ,  Arthur TURKIN

IPC: C09K3/14 ,  B24D3/28 ,  B24D3/34 ,  B24D18/00

CPC classification number: C09K3/1436 ,  B24D3/28 ,  B24D3/34 ,  B24D18/0072

Abstract: An abrasive article can include a body including a first portion coupled to a second portion in a radial plane. The body can include a central opening extending in an axial direction of the body through the first portion and through the second portion. The central opening can include a circumferential surface defining an inner diameter of the body. The circumferential surface can be defined by at least a portion of the first portion and at least a portion of the second portion. The first portion can include first abrasive particles contained within a first bond material, including an inorganic material, and the second portion can include second abrasive particles contained within a second bond material, including an organic material. The organic material can include epoxy. In an embodiment, the second portion comprises an elongation-at-fracture of less than 2.7%, a Stiffness Value of at least 8.3, or a combination thereof.

公开(公告)号：US20240269045A1

公开(公告)日：2024-08-15

申请号：US18647298

申请日：2024-04-26

Applicant: Imam Abdulrahman Bin Faisal University

Inventor： Mohamed Amr Aly Mahrous GHANEM ,  Mohamed Moustafa Ahmed GAD

IPC: A61K6/17 ,  B82Y40/00 ,  C09K3/14

CPC classification number: A61K6/17 ,  C09K3/1481 ,  B82Y40/00

Abstract: A dental polishing paste and a method of surface finishing a dental ceramic with the dental polishing paste is described. The dental polishing paste includes 60 to 90 weight percentage (wt. %) glycerin; 7.5 to 17.5 wt. % inorganic nanoparticles such as, diamond or zirconia, having a mean particle size of 5 to 25 nanometer (nm); and 2.5 to 32.5 wt. % additive, each based on a total weight of dental polishing paste.