发明申请
- 专利标题: Electrically conductive composite
- 专利标题(中): 导电复合材料
-
申请号: US11083307申请日: 2005-03-18
-
公开(公告)号: US20050209385A1公开(公告)日: 2005-09-22
- 发明人: Kenichi Higashi , Takashi Fujimoto , Yuji Ikezawa
- 申请人: Kenichi Higashi , Takashi Fujimoto , Yuji Ikezawa
- 申请人地址: JP Tokyo 104-8260
- 专利权人: Sumitomo Chemical Company, Limited
- 当前专利权人: Sumitomo Chemical Company, Limited
- 当前专利权人地址: JP Tokyo 104-8260
- 优先权: JP2004-082140 20040322
- 主分类号: C08J5/04
- IPC分类号: C08J5/04 ; C08K3/08 ; C08K7/04 ; C08K7/06 ; C08L101/12 ; C09D5/24 ; H01B1/22
摘要:
Disclosed is an electrically conductive composite including (A) electrically conductive fibers, (B) fibrous or rod-shaped low-melting metal which has a melting point lower than that of component (A) and is free of lead, and (C) a thermoplastic resin, the electrically conductive composite including a composite fiber bundle containing component (A) and component (B), the composite fiber bundle being covered with component (C), wherein in the electrically conductive composite, the ratios of the weights of components (A), (B) and (C) to the combined weight of components (A), (B) and (C) are 50-95% by weight for component (A), 4-40% by weight for component (B) and 1-20% by weight for component (C), wherein in the electrically conductive composite, the weight ratio of component (B) to component (A) is 0.31-0.8, and wherein in the composite fiber bundle, component (B) is enclosed in a bundle of component (A).
信息查询