发明申请
- 专利标题： Method to contact patterned electrodes on porous substrates and devices thereby
- 专利标题（中）： 接触多孔基底和器件上的图案化电极的方法
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申请号： US10992827申请日： 2004-11-19
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公开(公告)号： US20050210672A1公开(公告)日： 2005-09-29
- 发明人: John Reynolds , Avni Argun , Pierre Aubert , Mathieu Berard
- 申请人： John Reynolds , Avni Argun , Pierre Aubert , Mathieu Berard
- 主分类号： G02F1/155
- IPC分类号： G02F1/155 ; H01G7/00 ; H01L21/316 ; H01L21/768 ; H01L27/32 ; H01L51/00 ; H02N2/00
摘要：
A method for contacting patterned electrode devices includes the steps of providing a porous substrate, depositing electrically conductive material to form at least one electrode on a front-side of the porous substrate and depositing at least one electrically conductive back-side contact trace on the back-side of the substrate. A portion of the electrically conductive material penetrates into the substrate. A device is formed including the electrode on the front side of the substrate, wherein the electrode is electrically coupled by a conducting channel including the electrically conductive material through the substrate to the back-side contact trace.