发明申请
- 专利标题： Apparatus and method for removing metal from wafer edge
- 专利标题（中）： 从晶片边缘去除金属的装置和方法
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申请号： US10810619申请日： 2004-03-29
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公开(公告)号： US20050211379A1公开(公告)日： 2005-09-29
- 发明人: Hung-Wen Su , Ming-Hsing Tsai
- 申请人： Hung-Wen Su , Ming-Hsing Tsai
- 主分类号： B44C1/22
- IPC分类号： B44C1/22
摘要：
Apparatus and method for removing copper from wafer edge. The apparatus of the invention includes a bath tank for containing a chemical bath, a rotatable wafer chuck for holding a wafer vertical to the chemical bath, wherein at least the edge of the wafer is covered with a metal layer, and a sliding element is disposed on one end of the rotatable wafer chuck such that the rotatable wafer chuck can move in a vertical direction to the chemical bath.
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