发明申请
- 专利标题： Tape automated bonding with strip carrier frame assembly
- 专利标题（中）： 胶带自动粘接带条承载架组件
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申请号： US11143379申请日： 2005-06-01
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公开(公告)号： US20050217787A1公开(公告)日： 2005-10-06
- 发明人: Yukihiro Murakami , Kinya Ichikawa
- 申请人： Yukihiro Murakami , Kinya Ichikawa
- 主分类号： H01L23/498
- IPC分类号： H01L23/498 ; H01L23/544 ; H01L25/065 ; H01L21/44 ; B32B31/00
摘要：
In one embodiment of the invention, a die is bonded on a strip carrier frame having a carrier alignment landmark. A tape automated bonding (TAB) strip having a TAB alignment landmark is aligned with the strip carrier frame. The TAB strip is bonded to the strip carrier frame to form a bonded unit.
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