发明申请
- 专利标题： Magnetron sputtering source and chamber therefor
- 专利标题（中）： 磁控溅射源及其室
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申请号： US11141572申请日： 2005-05-31
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公开(公告)号： US20050217992A1公开(公告)日： 2005-10-06
- 发明人: Bernhard Cord , Gerd Deppich , Karl-Heinz Schuller , Oliver Keitel
- 申请人： Bernhard Cord , Gerd Deppich , Karl-Heinz Schuller , Oliver Keitel
- 专利权人： Unaxis Deutschland GmbH
- 当前专利权人： Unaxis Deutschland GmbH
- 优先权： DE10004824.2 20000204
- 主分类号： H05H1/46
- IPC分类号： H05H1/46 ; C23C14/34 ; C23C14/35 ; G11B5/851 ; G11B11/105 ; H01J37/34 ; H01L21/203
摘要：
A magnetron sputtering source with a target having a surface to be sputtered, has a magnet arrangement for generating on the surface a magnetron magnetic field pattern, so as to generate on the surface to be sputtered an outer erosion profile along a substantially circular locus and an inner erosion profile within the outer erosion profile. The surface consists of a material with at least two elements of different weight and the magnet arrangement is adapted to form the inner erosion profile three-dimensionally cup-shaped.
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