发明申请
- 专利标题： Particle packing of microdevice
- 专利标题（中）： 微型装置的颗粒包装
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申请号： US10821543申请日： 2004-04-09
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公开(公告)号： US20050224134A1公开(公告)日： 2005-10-13
- 发明人: Hongfeng Yin , Kevin Killeen , Reid Brennen , Uwe Effelsberg
- 申请人： Hongfeng Yin , Kevin Killeen , Reid Brennen , Uwe Effelsberg
- 主分类号： G01N30/56
- IPC分类号： G01N30/56 ; G01N35/00 ; B67C3/02
摘要：
Provided are apparatuses and methods for introducing particles into a microdevice conduit. Also provided are microdevices containing a plurality of particles that occupy at least about 25 volume percent of a microconduit. In some instances, particles may controllably form a particle bridge in a bridging zone within a microdevice.
公开/授权文献
- US07077175B2 Particle packing of microdevice 公开/授权日：2006-07-18
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