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发明申请
US20050224935A1 Organic electronic packages having hermetically sealed edges and methods of manufacturing such packages 失效
具有气密密封边缘的有机电子封装和制造这种包装的方法

Organic electronic packages having hermetically sealed edges and methods of manufacturing such packages
摘要：
Organic electronic packages having sealed edges. More specifically, packages having organic electronic devices are provided. A number of sealing mechanisms are provided to hermetically seal the edges of the package to completely protect the organic electronic device from external elements. A sealant may be implemented to completely surround the organic electronic device. Alternatively, edge wraps may be provided to completely surround the organic electronic device.
摘要（中）：

有机电子封装具有密封边缘。 更具体地，提供了具有有机电子器件的封装。 提供多个密封机构以气密地密封包装的边缘，以将外部元件完全保护有机电子装置。 可以实现密封剂以完全围绕有机电子设备。 或者，可以提供边缘包裹以完全围绕有机电子设备。

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