发明申请
- 专利标题： Bonding pad structure and method of forming the same
- 专利标题（中）： 接合垫结构及其形成方法
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申请号： US10824035申请日： 2004-04-14
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公开(公告)号： US20050230847A1公开(公告)日： 2005-10-20
- 发明人: Jian-Hsing Lee , Pao-Kang Niu , Ko-Yi Lee
- 申请人： Jian-Hsing Lee , Pao-Kang Niu , Ko-Yi Lee
- 主分类号： H01L23/48
- IPC分类号： H01L23/48 ; H01L23/485 ; H01L23/60
摘要：
A bonding pad structure and fabrication method thereof. A bonding pad is substantially surrounded and insulated by a dielectric layer, wherein the bonding pad is formed of at least one first conductive layer having a wiring layer with a stripe layout and a first edge portion, a second conductive layer having a wire bonding portion and a second edge portion and a plurality of plugs electrically connecting the wiring layer and the wire bonding portion. A conductive structure of an array of metal plugs or a metal damascene structure is formed to connect the first edge portion and the second edge portion, thereby preventing burn out of the first edge portion during an ESD event.
公开/授权文献
- US07148574B2 Bonding pad structure and method of forming the same 公开/授权日：2006-12-12
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