发明申请
- 专利标题: Electronically integrated vehicle structure
- 专利标题(中): 电子集成车辆结构
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申请号: US10828396申请日: 2004-04-20
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公开(公告)号: US20050231907A1公开(公告)日: 2005-10-20
- 发明人: Andrew Glovatsky , Jay Baker , Richard McMillan , Myron Lemecha , Daniel Vander Sluis
- 申请人: Andrew Glovatsky , Jay Baker , Richard McMillan , Myron Lemecha , Daniel Vander Sluis
- 专利权人: Visteon Global Technologies, Inc.
- 当前专利权人: Visteon Global Technologies, Inc.
- 主分类号: B60R16/02
- IPC分类号: B60R16/02 ; H05K7/20
摘要:
An integrated vehicle structure includes an electronic site in a plastic support structure. The electronic site has a flexible substrate with electronic components mounted thereon. The plastic support structure defines a plastic mounting surface which includes a plurality of elongated ribs projecting from the plastic support structure. Each of the ribs have a side edge forming a portion of the plastic mounting surface. The flexible substrate is mounted to the plastic mounting surface, and a plurality of air flow passageways are defined by adjacent ribs in the flexible substrate. A method support structure may also be provided which defines a metal mounting surface. One or more electronic sides may be attached to the metal and plastic mounting surfaces.
公开/授权文献
- US07102888B2 Electronically integrated vehicle structure 公开/授权日:2006-09-05
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