发明申请
- 专利标题： Chemically amplified positive resist composition and patterning process
- 专利标题（中）： 化学扩增正性抗蚀剂组成和图案化工艺
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申请号： US11105457申请日： 2005-04-14
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公开(公告)号： US20050233245A1公开(公告)日： 2005-10-20
- 发明人: Ryuji Koitabashi , Satoshi Watanabe , Youichi Ohsawa
- 申请人： Ryuji Koitabashi , Satoshi Watanabe , Youichi Ohsawa
- 专利权人： Shin-Etsu Chemical Co., Ltd.
- 当前专利权人： Shin-Etsu Chemical Co., Ltd.
- 优先权： JP2004-120635 20040415
- 主分类号： G03F7/004
- IPC分类号： G03F7/004 ; C08F212/14 ; C08F220/10 ; G03C1/492 ; G03F7/039 ; H01L21/027
摘要：
A chemically amplified positive resist composition comprising a specific 2,4,6-triisopropylbenzenesulfonate compound as a photoacid generator, a polymer which changes its solubility in an alkaline developer under the action of acid, and a basic compound has a high sensitivity, a high contrast of dissolution of resist film, a high resolution, and good storage stability.
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