发明申请
US20050233571A1 Flip chip package, semiconductor package with bumps and method for manufacturing semiconductor package with bumps
审中-公开
倒装芯片封装，具有凸块的半导体封装和用于制造具有凸块的半导体封装的方法
- 专利标题： Flip chip package, semiconductor package with bumps and method for manufacturing semiconductor package with bumps
- 专利标题（中）： 倒装芯片封装，具有凸块的半导体封装和用于制造具有凸块的半导体封装的方法
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申请号： US10921967申请日： 2004-08-20
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公开(公告)号： US20050233571A1公开(公告)日： 2005-10-20
- 发明人: Su Tao , Min-Lung Huang , Ho-Ming Tong
- 申请人： Su Tao , Min-Lung Huang , Ho-Ming Tong
- 申请人地址： TW Kaoshiung
- 专利权人： Advanced Semiconductor Engineering, Inc.
- 当前专利权人： Advanced Semiconductor Engineering, Inc.
- 当前专利权人地址： TW Kaoshiung
- 优先权： TW092123210 20030822
- 主分类号： H01L21/44
- IPC分类号： H01L21/44 ; H01L21/48 ; H01L21/56 ; H01L23/48 ; H01L23/485 ; H01L23/498
摘要：
A semiconductor chip with bumps formed therein comprises an active surface, a plurality of bonding pads, a passivation layer, a plurality of first UBMs (under bump metallurgy), a second UBM, a plurality of first bumps, and a plurality of second bumps. The bonding pads are disposed on the active surface of the semiconductor chip. The passivation layer covers the active surface of the semiconductor chip with the pads exposed out of the passivation layer. The first UMBs are individually disposed on the bonding pads. The second UMB is disposed on at least two of the bonding pads. The first bumps are disposed on the first UMBs. The second bumps are disposed on the second UBM.
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