发明申请
- 专利标题： Substrate treating method and apparatus
- 专利标题（中）： 基板处理方法及装置
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申请号： US11106313申请日： 2005-04-14
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公开(公告)号： US20050236018A1公开(公告)日： 2005-10-27
- 发明人: Shuzo Nagami
- 申请人： Shuzo Nagami
- 专利权人： Dainippon Screen Mfg. Co., Ltd.
- 当前专利权人： Dainippon Screen Mfg. Co., Ltd.
- 优先权： JP2004-131421 20040427
- 主分类号： H01L21/304
- IPC分类号： H01L21/304 ; B08B3/00 ; B08B3/02 ; H01L21/00 ; H01L21/02
摘要：
A substrate treating method for performing a predetermined treatment of substrates. The method includes a step of performing chemical treatment of the substrates with a chemical, and a step of performing deionized water cleaning treatment of the substrates with superheated steam obtained by heating deionized water.
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