Invention Application
- Patent Title: Thermal protrusion reduction in magnet heads by utilizing a heat-spreading pad
- Patent Title (中): 通过利用散热垫使磁头的热突起减少
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Application No.: US11172173Application Date: 2005-06-30
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Publication No.: US20050237667A1Publication Date: 2005-10-27
- Inventor: Devendra Chhabra , Rod Lee , Glen Garfunkel , Moris Dovek , Cherng-Chyi Han
- Applicant: Devendra Chhabra , Rod Lee , Glen Garfunkel , Moris Dovek , Cherng-Chyi Han
- Assignee: HEADWAY TECHNOLOGIES, INC.
- Current Assignee: HEADWAY TECHNOLOGIES, INC.
- Main IPC: G11B5/31
- IPC: G11B5/31 ; G11B5/60

Abstract:
A magnetic read/write head and slider assembly and method for forming said magnetic read/write head and slider assembly, wherein said assembly has improved heat spreading and dissipation properties and exhibits significantly reduced thermal protrusion during operation. The method of formation is simple and efficient, involving only the extension of one of the conductive mounting pads so that it is in thermal contact with a portion of the slider assembly surface that is over the read/write element.
Public/Granted literature
- US07154708B2 Thermal protrusion reduction in magnet heads by utilizing a heat-spreading pad Public/Granted day:2006-12-26
Information query
IPC分类: