发明申请
- 专利标题： Display device and manufacturing method of the same
- 专利标题（中）： 显示装置及其制造方法相同
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申请号： US11103493申请日： 2005-04-12
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公开(公告)号： US20050242436A1公开(公告)日： 2005-11-03
- 发明人: Hideaki Abe , Makoto Sato , Mitsuru Goto
- 申请人： Hideaki Abe , Makoto Sato , Mitsuru Goto
- 优先权： JP2004-119263 20040414
- 主分类号： H01L21/60
- IPC分类号： H01L21/60 ; G02F1/13 ; G02F1/133 ; G09F9/00 ; G09G3/36 ; H01L21/44 ; H01L23/48 ; H01L23/485 ; H01L23/544
摘要：
The present invention enhances the mounting accuracy of a drive circuit chip on a substrate thus realizing a display of high quality. Bumps (for example, gold bumps) on the drive circuit chip are used for alignment. Here, to enhance the recognition property of the alignment bumps, a plane shape of a conductive layer which is formed between a semiconductor substrate (Si substrate) of the drive circuit chip and the alignment bump is set to be included within a profile of a plane shape of the alignment bump. That is, by preventing the conductive layer from being observed in a periphery of the alignment bump, it is possible to prevent a photographed pattern of the bump taken by a camera or the like from be influenced by the conductive layer.
公开/授权文献
- US07141877B2 Display device and manufacturing method of the same 公开/授权日：2006-11-28
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