发明申请
- 专利标题: Method of forming capacitor for semiconductor device
- 专利标题(中): 形成半导体器件电容器的方法
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申请号: US11062546申请日: 2005-02-23
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公开(公告)号: US20050245026A1公开(公告)日: 2005-11-03
- 发明人: Dong-Chan Kim , Chang-Jin Kang , Byeong-Yun Nam , Kyeong-Koo Chi
- 申请人: Dong-Chan Kim , Chang-Jin Kang , Byeong-Yun Nam , Kyeong-Koo Chi
- 优先权: KR2004-17504 20040316
- 主分类号: H01L27/108
- IPC分类号: H01L27/108 ; H01L21/02 ; H01L21/8242
摘要:
A method of forming a capacitor for a semiconductor device is disclosed. According to the method, a silicon germanium layer and an oxide layer are used as mold layers for forming a storage electrode. The oxide layer and the silicon germanium layer are anisotropically etched to form an opening and then the silicon germanium layer is further isotropically etched to form a recessed portion of the opening, such that the recessed portion of the opening formed in the silicon germanium layer is wider than at least some portion of the opening through the oxide layer. Thus, the mold layers are used to form a storage electrode having a lower portion which is wider than an upper portion thereof.
公开/授权文献
- US07125766B2 Method of forming capacitor for semiconductor device 公开/授权日:2006-10-24
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