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公开(公告)号:US11581409B2
公开(公告)日:2023-02-14
申请号:US17176494
申请日:2021-02-16
发明人: Thomas Feil
IPC分类号: H01L27/108 , H01L21/8242 , H01L29/40 , H01L29/78 , H01L29/66 , H01L29/739 , H01L21/283 , H01L29/43 , H01L29/423
摘要: Disclosed is a transistor device which includes a semiconductor body having a first surface, a source region, a drift region, a body region being arranged between the source region and the drift region, a gate electrode adjacent the body region and dielectrically insulated from the body region by a gate dielectric, and a field electrode adjacent the drift region and dielectrically insulated from the drift region by a field electrode dielectric, wherein the field electrode comprises a first layer and a second layer, wherein the first layer has a lower electrical resistance than the second layer, wherein a portion of the second layer is disposed above and directly contacts a portion of the first layer.
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公开(公告)号:US11205680B2
公开(公告)日:2021-12-21
申请号:US16558818
申请日:2019-09-03
申请人: NXP USA, INC.
发明人: Anirban Roy
IPC分类号: H01L27/108 , H01L21/8242 , H01L21/20 , H01L27/24 , H01L27/22 , H01L43/12 , H01L43/02 , H01L45/00 , H01L21/768 , H01L29/94 , H01L27/06 , H01L29/40
摘要: A semiconductor device and methods for making the same are disclosed. The device may include: a first transistor structure; a second transistor structure; a capacitor structure comprising a trench in the substrate between the first and second transistor structures, the capacitor structure further comprising a doped layer over the substrate, a dielectric layer over the doped layer, and a conductive fill material over the dielectric layer; a first conductive contact from the first transistor structure to a first bit line; a second conductive contact from the second transistor to a non-volatile memory element; and a third conductive contact from the non-volatile memory element to a second bit line.
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公开(公告)号:US11152382B2
公开(公告)日:2021-10-19
申请号:US16920717
申请日:2020-07-05
申请人: Donghyuk Ju
发明人: Donghyuk Ju
IPC分类号: H01L27/108 , H01L21/8242 , H01L27/112 , H01L29/423 , H01L27/092 , H01L29/06 , H01L29/80
摘要: An antifuse OTP memory bit cell comprises a gate electrode, a gate dielectric and source/drain diffusions formed in an active area of a semiconductor substrate. The source/drain diffusions are connected under the gate electrode by lateral diffusion but they don't have to be. If connected, a rectifying contact is created in a programmed bit cell. If unconnected, a rectifying contact or a non-rectifying contact is created in a programmed bit cell. Whether connected or unconnected, the device operates as an OTP memory bit cell without an access transistor.
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公开(公告)号:US11145710B1
公开(公告)日:2021-10-12
申请号:US16913549
申请日:2020-06-26
IPC分类号: H01L21/8242 , H01L27/108 , H01L49/02 , H01L21/285
摘要: Methods, apparatuses, and systems related to forming a barrier material between an electrode and a dielectric material are described. An example method includes forming a dielectric material on a bottom electrode material of a storage node in a semiconductor fabrication process. The method further includes forming a barrier material on the dielectric material to reduce oxygen vacancies in the dielectric material. The method further includes forming a top electrode on the barrier material.
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公开(公告)号:US10672771B2
公开(公告)日:2020-06-02
申请号:US16175174
申请日:2018-10-30
IPC分类号: H01L27/108 , H01L21/8242
摘要: To provide a semiconductor device that can reduce power consumption and retain data for a long time and a memory device including the semiconductor device. The semiconductor device includes a word line divider, a memory cell, a first wiring, and a second wiring. The word line divider is electrically connected to the first wiring and the second wiring. The memory cell includes a first transistor with a dual-gate structure. A first gate of the first transistor is electrically connected to the first wiring, and a second gate of the first transistor is electrically connected to the second wiring. The word line divider supplies a high-level potential or a low-level potential to the first wiring and supplies a predetermined potential to the second wiring, whereby a threshold voltage of the first transistor is changed. With such a configuration, a semiconductor device that can reduce power consumption and retain data for a long time is driven.
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公开(公告)号:US10593677B2
公开(公告)日:2020-03-17
申请号:US15947856
申请日:2018-04-08
发明人: Feng-Yi Chang , Fu-Che Lee , Chieh-Te Chen , Yi-Ching Chang
IPC分类号: H01L27/108 , H01L21/8242 , H01L23/532 , H01L21/768 , H01L23/528
摘要: The present invention discloses a semiconductor structure with capacitor landing pad and a method for fabricating a capacitor landing pad. The semiconductor structure with capacitor landing pad includes a substrate having a plurality of contact structures, a first dielectric layer disposed on the substrate and the contact structures, and a plurality of capacitor landing pads, each of the capacitor landing pads being located in the first dielectric layer and electrically connected to the contact structure, wherein the capacitor landing pads presents a shape of a wide top and a narrow bottom and a top surface of the capacitor landing pads have a concave shape.
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公开(公告)号:US10297491B2
公开(公告)日:2019-05-21
申请号:US15861090
申请日:2018-01-03
发明人: Chien-Chih Chou , Kong-Beng Thei
IPC分类号: H01L21/8242 , H01L21/762 , H01L29/423 , H01L29/66 , H01L29/78 , H01L29/06 , H01L29/10 , H01L21/761 , H01L29/40
摘要: A structure of a semiconductor includes an isolation structure in a well of a substrate. An upper surface of the isolation structure in the well of the substrate is lower than an upper surface of the substrate and an upper surface of the well. A gate electrode has a first portion over the isolation structure, and a second portion laterally adjacent to the first portion, and above the first portion.
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公开(公告)号:US10141395B2
公开(公告)日:2018-11-27
申请号:US15832898
申请日:2017-12-06
发明人: Chih-Chao Yang
IPC分类号: H01L29/00 , H01L21/8236 , H01L21/8242 , H01L21/20 , H01L49/02 , H01L21/768
摘要: A metal-insulator-metal (MIM) capacitor, includes a cross-sectional view: a first metal plate; a second metal plate; a third metal plate; and a layer of high-k material contacting the first metal plate, the second metal plate, and the third metal plate.
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公开(公告)号:US09985035B1
公开(公告)日:2018-05-29
申请号:US15820455
申请日:2017-11-22
发明人: Li-Wei Feng , Chien-Ting Ho , Yu-Cheng Tung
IPC分类号: H01L27/108 , H01L21/8242
CPC分类号: H01L27/10885 , H01L27/10808 , H01L27/10814 , H01L27/1085 , H01L27/10855 , H01L27/10894 , H01L27/10897
摘要: A semiconductor memory structure includes a substrate including a memory cell region and a cell edge region adjacent to the memory cell region. Active regions are formed in the substrate and in the memory cell region and the cell edge region. At least a dummy bit line is formed on the active regions in the cell edge region. The dummy bit line extends along a first direction and overlaps at least two active regions along a second direction. The dummy bit line further includes a first inner line portion and an outer line portion. The first inner line portion and the outer line portion extend along the first direction and a width of the first inner line portion is different from a width of the outer line portion.
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公开(公告)号:US09960170B1
公开(公告)日:2018-05-01
申请号:US15614077
申请日:2017-06-05
发明人: Daeik Kim , Kiseok Lee , Keunnam Kim , Bong-Soo Kim , Jemin Park , Chan-Sic Yoon , Yoosang Hwang
IPC分类号: H01L21/8242 , H01L27/108
CPC分类号: H01L27/10897 , H01L27/10814 , H01L27/10823 , H01L27/10852 , H01L27/10876 , H01L27/10885 , H01L27/10888 , H01L27/10894
摘要: Methods of fabricating a memory device are provided. The methods may include forming a mask pattern including line-shaped portions that are parallel to each other and extend on a first region of a substrate. The mask pattern may extend on a second region of the substrate. The methods may also include forming word line regions in the first region using the mask pattern as a mask, forming word lines in the word line regions, respectively, and removing the mask pattern from the second region to expose the second region. The mask pattern may remain on the first region after removing the mask pattern from the second region. The methods may further include forming a channel epitaxial layer on the second region while using the mask pattern as a barrier to growth of the channel epitaxial layer on the first region.
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