Invention Application
- Patent Title: Hinge structure and electronic apparatus
- Patent Title (中): 铰链结构和电子设备
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Application No.: US11105352Application Date: 2005-04-14
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Publication No.: US20050250355A1Publication Date: 2005-11-10
- Inventor: Yung Kun Lin
- Applicant: Yung Kun Lin
- Assignee: ASUTeK COMPUTER INC.
- Current Assignee: ASUTeK COMPUTER INC.
- Priority: TW093112698 20040505
- Main IPC: E05D3/06
- IPC: E05D3/06 ; E05D7/082 ; G06F1/16 ; H01R12/00 ; H05K7/14

Abstract:
A hinge structure is for connecting a first machine body and a second machine body. The hinge structure includes a supporting bracket, a first connecting assembly, and a second connecting assembly. In this case, the supporting bracket has a first portion and a second portion. The first connecting assembly has a third portion and a fourth portion. The third portion connects with the first portion. The fourth portion is fixed with the first machine body. The supporting bracket and the first connecting assembly rotate to each other with a first rotational axis. The second connecting assembly has a fifth portion and a sixth portion. The fifth portion connects with the second portion. The sixth portion is fixed with the second machine body. The supporting bracket and the second connecting assembly rotate to each other with a second rotational axis.
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