发明申请
- 专利标题: System on chip development with reconfigurable multi-project wafer technology
- 专利标题(中): 系统片上开发与可重构多项目晶圆技术
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申请号: US11119086申请日: 2005-04-29
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公开(公告)号: US20050257177A1公开(公告)日: 2005-11-17
- 发明人: Kun-Lung Chen , Shine Chung , Yung-Chin Hou , Yu-Chun Wu
- 申请人: Kun-Lung Chen , Shine Chung , Yung-Chin Hou , Yu-Chun Wu
- 专利权人: Taiwan Semiconductor Manufacturing Co., Ltd.
- 当前专利权人: Taiwan Semiconductor Manufacturing Co., Ltd.
- 主分类号: G06F7/00
- IPC分类号: G06F7/00 ; G06F17/50 ; H03K19/177
摘要:
A method is disclosed for designing a semiconductor circuit on a multi-project wafer (MPW). One or more standard modules designed by one or more vendors with verified functions are first identified. Some of the standard modules are charged based on usage. At least one reconfigurable module of the MPW is programmed by making one or more connections through one or more connection layers. The standard modules are further connected with the programmed reconfigurable module according to the predetermined design of the circuit. The completed circuit is then verified for final uses.
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