发明申请
- 专利标题： Structure for mounting electronic component on wiring board
- 专利标题（中）： 将电子元件安装在接线板上的结构
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申请号： US11127580申请日： 2005-05-12
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公开(公告)号： US20050257954A1公开(公告)日： 2005-11-24
- 发明人: Toru Aoyagi
- 申请人： Toru Aoyagi
- 优先权： JP2004-147891 20040518
- 主分类号： H01L21/60
- IPC分类号： H01L21/60 ; H01L23/485 ; H05K1/02 ; H05K1/09 ; H05K1/18 ; H05K3/24 ; H05K3/34
摘要：
A structure for mounting an electronic component on a wiring board according to the invention includes a wiring board that is provided with wiring patterns, each having a land portion, and an electronic component that has a plurality of electrodes which are soldered to the land portions. Each land portion is made of a first metallic material which is solderable. Further, on each wiring pattern adjacent to each land portion, a second metallic material which is nonsolderable is provided.
公开/授权文献
- US07408785B2 Structure for mounting electronic component on wiring board 公开/授权日：2008-08-05
信息查询
IPC分类:
