发明申请
- 专利标题: Hot plate
- 专利标题(中): 热板
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申请号: US10901109申请日: 2004-07-29
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公开(公告)号: US20050258164A1公开(公告)日: 2005-11-24
- 发明人: Yasuji Hiramatsu , Yasutaka Ito
- 申请人: Yasuji Hiramatsu , Yasutaka Ito
- 申请人地址: JP Ogaki-shi
- 专利权人: IBIDEN CO., LTD.
- 当前专利权人: IBIDEN CO., LTD.
- 当前专利权人地址: JP Ogaki-shi
- 优先权: JP2000-181941 20000616
- 主分类号: H05B3/20
- IPC分类号: H05B3/20 ; C04B35/581 ; C04B35/584 ; C23C14/50 ; C23C16/46 ; H01L21/00 ; H05B3/10 ; H05B3/14 ; H05B3/16 ; H05B3/18 ; H05B3/68 ; H05B3/74
摘要:
An object of the present invention is to provide a hot plate which is superior in thermal conductivity, is superior in temperature-rising/dropping property, particularly in temperature-dropping property, and has high cooling thermal efficiency at the time of cooling. The hot plate of the present invention is a hot plate comprising: a ceramic substrate; and a resistance heating element formed on the surface of said ceramic substrate or inside said ceramic substrate, wherein said ceramic substrate has a leakage quantity of 10−7 Pa·m3/sec (He) or less by measurement with a helium leakage detector.
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