发明申请
- 专利标题： Processor heat sink retention module and assembly
- 专利标题（中）： 处理器散热器固定模块和组件
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申请号： US10848975申请日： 2004-05-19
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公开(公告)号： US20050259399A1公开(公告)日： 2005-11-24
- 发明人: Stephen DelPrete , Donald Amaral
- 申请人： Stephen DelPrete , Donald Amaral
- 主分类号： H01L23/40
- IPC分类号： H01L23/40 ; H01L23/467 ; H05K7/20
摘要：
A heat sink retention module for an electronic device includes a base comprising mounting lugs configured to be mounted to a circuit board, and frame elements extending between the mounting lugs to define at least one keep out area interior to the frame elements and at least one keep out area exterior to the frame elements. The frame elements include at least one frame element extending at an oblique angle to another of the frame elements, and heat sink retention posts extend vertically upward from the frame elements.
公开/授权文献
- US07133288B2 Processor heat sink retention module and assembly 公开/授权日：2006-11-07
信息查询
IPC分类:
