发明申请
- 专利标题: Antenna-coupled microbolometer
- 专利标题(中): 天线耦合微热辐射计
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申请号: US10525074申请日: 2003-08-20
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公开(公告)号: US20050264454A1公开(公告)日: 2005-12-01
- 发明人: Seong-Hwoon Kim , Richard Leblanc , Lee Mirth
- 申请人: Seong-Hwoon Kim , Richard Leblanc , Lee Mirth
- 申请人地址: US MD Bethesda 20817
- 专利权人: Lockheed Martin Corporation
- 当前专利权人: Lockheed Martin Corporation
- 当前专利权人地址: US MD Bethesda 20817
- 国际申请: PCT/US03/25878 WO 20030820
- 主分类号: G01J5/20
- IPC分类号: G01J5/20 ; G01K17/00 ; H01J5/02 ; H01L27/146 ; H01Q1/26
摘要:
An antenna-coupled microbolometer multilayer structure, and associated method of forming an antenna-coupled microbolometer multilayer structure are disclosed, where the structure includes a dielectric layer of dielectric material having at least one locally doped region doped with a dopant to provide a thermal conductive path from a first side to a second side of the dielectric layer. The structure includes an antenna on the first side of the dielectric layer coupled to the locally doped region; a read-out integrated circuit (ROIC) on the second side of the dielectric layer coupled to the locally doped region; a conductive substrate between the dielectric layer and the ROIC; and an electrical connection between the locally doped region and the ROIC, wherein the ROIC is connected to detect, via the electrical connection, a change in electrical resistivity of the locally doped region due to thermal energy absorbed from the antenna.
公开/授权文献
- US07199358B2 Antenna-coupled microbolometer 公开/授权日:2007-04-03
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