公开(公告)号：US20050264454A1

公开(公告)日：2005-12-01

申请号：US10525074

申请日：2003-08-20

申请人： Seong-Hwoon Kim ,  Richard Leblanc ,  Lee Mirth

发明人： Seong-Hwoon Kim ,  Richard Leblanc ,  Lee Mirth

IPC分类号： G01J5/20 ,  G01K17/00 ,  H01J5/02 ,  H01L27/146 ,  H01Q1/26

CPC分类号： G01K17/003 ,  G01J5/0837 ,  G01J5/20 ,  H01L27/14669

摘要： An antenna-coupled microbolometer multilayer structure, and associated method of forming an antenna-coupled microbolometer multilayer structure are disclosed, where the structure includes a dielectric layer of dielectric material having at least one locally doped region doped with a dopant to provide a thermal conductive path from a first side to a second side of the dielectric layer. The structure includes an antenna on the first side of the dielectric layer coupled to the locally doped region; a read-out integrated circuit (ROIC) on the second side of the dielectric layer coupled to the locally doped region; a conductive substrate between the dielectric layer and the ROIC; and an electrical connection between the locally doped region and the ROIC, wherein the ROIC is connected to detect, via the electrical connection, a change in electrical resistivity of the locally doped region due to thermal energy absorbed from the antenna.

摘要翻译： 公开了一种天线耦合的微测辐射热计多层结构以及形成天线耦合的微测热计多层结构的相关方法，其中该结构包括介电材料的电介质层，该电介质层具有掺杂有掺杂剂的至少一个局部掺杂区域，以提供导热路径 从电介质层的第一侧到第二侧。 该结构包括在与局部掺杂区域耦合的电介质层的第一侧上的天线; 在与局部掺杂区域耦合的电介质层的第二侧上的读出集成电路（ROIC）; 介电层和ROIC之间的导电基板; 以及局部掺杂区域和ROIC之间的电连接，其中ROIC被连接以通过电连接检测由于从天线吸收的热能而导致局部掺杂区域的电阻率的变化。