发明申请
- 专利标题: Tungsten encapsulated copper interconnections using electroplating
- 专利标题(中): 使用电镀的钨封装铜互连
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申请号: US11172992申请日: 2005-07-05
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公开(公告)号: US20050269708A1公开(公告)日: 2005-12-08
- 发明人: Panayotis Andricacos , Steven Boettcher , Fenton McFeely , Milan Paunovic
- 申请人: Panayotis Andricacos , Steven Boettcher , Fenton McFeely , Milan Paunovic
- 主分类号: H01L21/288
- IPC分类号: H01L21/288 ; H01L21/768 ; H01L23/48
摘要:
An interconnection structure is provided wherein comprises a substrate having a dielectric layer with a via opening therein; wherein the opening has a barrier layer; and electrodeposited copper.