发明申请
- 专利标题: Electroconductive proppant compositions and related methods
- 专利标题(中): 导电支撑剂组合物及相关方法
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申请号: US10868608申请日: 2004-06-15
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公开(公告)号: US20050274510A1公开(公告)日: 2005-12-15
- 发明人: Philip Nguyen , Dwight Fulton
- 申请人: Philip Nguyen , Dwight Fulton
- 主分类号: E21B43/267
- IPC分类号: E21B43/267 ; E21B47/00 ; E21B47/024
摘要:
Some embodiments provide methods of obtaining data from a portion of a subterranean formation comprising providing proppant particulates wherein at least a portion of the proppant particulates are coated with an electroconductive resin that comprises a resin and a conductive material; placing the proppant particulates into a portion of a fracture so as to form an electroconductive proppant pack; providing a transmitter capable of sending an electric current into the electroconductive proppant pack; sending an electric current into the electroconductive proppant pack with the transmitter; providing a receiver capable of deflecting a reflected or conducted electric signal from the electroconductive proppant pack; and, receiving a reflected electric signal with the receiver. Other embodiments provide electroconductive proppant packs comprising proppant particulates wherein a portion of the proppant particulates are coated with an electroconductive resin and wherein the electroconductive resin comprises a resin and a conductive material.
公开/授权文献
- US07073581B2 Electroconductive proppant compositions and related methods 公开/授权日:2006-07-11
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