发明申请
- 专利标题： Multi-chip module package structure
- 专利标题（中）： 多芯片模块封装结构
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申请号： US10854131申请日： 2004-05-26
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公开(公告)号： US20050275080A1公开(公告)日： 2005-12-15
- 发明人: Chih-Ming Chung
- 申请人： Chih-Ming Chung
- 主分类号： H01L23/02
- IPC分类号： H01L23/02 ; H01L23/31 ; H01L25/065
摘要：
The present invention relates to a multi-chip module package structure including a substrate with at least a slot, at least a first and a second chips and a molding compound. The first chip is larger than the second chip. The two chips are respectively disposed on two opposite surfaces of the substrate, while the slot exposes the bonding pads of the first chip. The bonding pads of the first chip are electrically connected to the top surface of the substrate by wire bonding. The second chip is electrically attached to the substrate by flip chip bonding or wire bonding. The molding compound at least covers the first and second chips and a portion of the substrate.
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