发明申请
- 专利标题： Semiconductor device, circuit substrate, electro-optic device and electronic appliance
- 专利标题（中）： 半导体器件，电路基板，电光器件和电子设备
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申请号： US11128848申请日： 2005-05-13
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公开(公告)号： US20050275115A1公开(公告)日： 2005-12-15
- 发明人: Shuichi Tanaka , Haruki Ito , Yasuhito Aruga , Ryohei Tamura , Michiyoshi Takano
- 申请人： Shuichi Tanaka , Haruki Ito , Yasuhito Aruga , Ryohei Tamura , Michiyoshi Takano
- 优先权： JP2004-175534 20040614
- 主分类号： G02F1/1345
- IPC分类号： G02F1/1345 ; G09G3/00 ; H01L21/3205 ; H01L21/60 ; H01L23/52 ; H01L27/146 ; H01L29/40
摘要：
A semiconductor device in the first embodiment includes: an electrode pad and a resin projection, formed on an active surface; a conductive film deposited from a surface of the electrode pad to a surface of the resin projection; a resin bump formed with the resin projection and with the conductive film. The semiconductor device is conductively connected to the opposing substrate through the resin bump electrode. The testing electrode is formed with the conductive film that is extended and applied to the opposite side of the electrode pad across the resin projection.
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