公开(公告)号：US07888799B2

公开(公告)日：2011-02-15

申请号：US12776667

申请日：2010-05-10

申请人： Shuichi Tanaka ,  Haruki Ito ,  Yasuhito Aruga ,  Ryohei Tamura ,  Michiyoshi Takano

发明人： Shuichi Tanaka ,  Haruki Ito ,  Yasuhito Aruga ,  Ryohei Tamura ,  Michiyoshi Takano

IPC分类号： H01L23/48

CPC分类号： G09G3/006 ,  H01L27/14601 ,  H01L2224/05001 ,  H01L2224/05022 ,  H01L2224/05124 ,  H01L2224/05548 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/05664 ,  H01L2224/05666 ,  H01L2224/05671 ,  H01L2224/05684 ,  H01L2224/16 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/00014

摘要： A semiconductor device in the first embodiment includes: an electrode pad and a resin projection, formed on an active surface; a conductive film deposited from a surface of the electrode pad to a surface of the resin projection; a resin bump formed with the resin projection and with the conductive film. The semiconductor device is conductively connected to the opposing substrate through the resin bump electrode. The testing electrode is formed with the conductive film that is extended and applied to the opposite side of the electrode pad across the resin projection.

摘要翻译： 第一实施例中的半导体器件包括：形成在有源表面上的电极焊盘和树脂突起; 从所述电极焊盘的表面沉积到所述树脂突起的表面的导电膜; 树脂凸起与树脂突起形成并与导电膜形成。 半导体器件通过树脂凸块电极导电地连接到相对的基板。 测试电极由导电膜形成，该导电膜延伸并施加到穿过树脂突起的电极焊盘的相对侧。

公开(公告)号：US20050275115A1

公开(公告)日：2005-12-15

申请号：US11128848

申请日：2005-05-13

申请人： Shuichi Tanaka ,  Haruki Ito ,  Yasuhito Aruga ,  Ryohei Tamura ,  Michiyoshi Takano

发明人： Shuichi Tanaka ,  Haruki Ito ,  Yasuhito Aruga ,  Ryohei Tamura ,  Michiyoshi Takano

IPC分类号： G02F1/1345 ,  G09G3/00 ,  H01L21/3205 ,  H01L21/60 ,  H01L23/52 ,  H01L27/146 ,  H01L29/40

CPC分类号： G09G3/006 ,  H01L27/14601 ,  H01L2224/05001 ,  H01L2224/05022 ,  H01L2224/05124 ,  H01L2224/05548 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/05664 ,  H01L2224/05666 ,  H01L2224/05671 ,  H01L2224/05684 ,  H01L2224/16 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/00014

摘要： A semiconductor device in the first embodiment includes: an electrode pad and a resin projection, formed on an active surface; a conductive film deposited from a surface of the electrode pad to a surface of the resin projection; a resin bump formed with the resin projection and with the conductive film. The semiconductor device is conductively connected to the opposing substrate through the resin bump electrode. The testing electrode is formed with the conductive film that is extended and applied to the opposite side of the electrode pad across the resin projection.

摘要翻译： 第一实施例中的半导体器件包括：形成在有源表面上的电极焊盘和树脂突起; 从所述电极焊盘的表面沉积到所述树脂突起的表面的导电膜; 树脂凸起与树脂突起形成并与导电膜形成。 半导体器件通过树脂凸块电极导电地连接到相对的基板。 测试电极由导电膜形成，该导电膜延伸并施加到穿过树脂突起的电极焊盘的相对侧。

公开(公告)号：US07276792B2

公开(公告)日：2007-10-02

申请号：US11128848

申请日：2005-05-13

申请人： Shuichi Tanaka ,  Haruki Ito ,  Yasuhito Aruga ,  Ryohei Tamura ,  Michiyoshi Takano

发明人： Shuichi Tanaka ,  Haruki Ito ,  Yasuhito Aruga ,  Ryohei Tamura ,  Michiyoshi Takano

IPC分类号： H01L23/48

CPC分类号： G09G3/006 ,  H01L27/14601 ,  H01L2224/05001 ,  H01L2224/05022 ,  H01L2224/05124 ,  H01L2224/05548 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/05664 ,  H01L2224/05666 ,  H01L2224/05671 ,  H01L2224/05684 ,  H01L2224/16 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/00014

摘要： A semiconductor device in the first embodiment includes: an electrode pad and a resin projection, formed on an active surface; a conductive film deposited from a surface of the electrode pad to a surface of the resin projection; a resin bump formed with the resin projection and with the conductive film. The semiconductor device is conductively connected to the opposing substrate through the resin bump electrode. The testing electrode is formed with the conductive film that is extended and applied to the opposite side of the electrode pad across the resin projection.

摘要翻译： 第一实施例中的半导体器件包括：形成在有源表面上的电极焊盘和树脂突起; 从所述电极焊盘的表面沉积到所述树脂突起的表面的导电膜; 树脂凸起与树脂突起形成并与导电膜形成。 半导体器件通过树脂凸块电极导电地连接到相对的基板。 测试电极由导电膜形成，该导电膜延伸并施加到穿过树脂突起的电极焊盘的相对侧。

公开(公告)号：US07741712B2

公开(公告)日：2010-06-22

申请号：US11855391

申请日：2007-09-14

申请人： Shuichi Tanaka ,  Haruki Ito ,  Yasuhito Aruga ,  Ryohei Tamura ,  Michiyoshi Takano

发明人： Shuichi Tanaka ,  Haruki Ito ,  Yasuhito Aruga ,  Ryohei Tamura ,  Michiyoshi Takano

IPC分类号： H01L23/48

CPC分类号： G09G3/006 ,  H01L27/14601 ,  H01L2224/05001 ,  H01L2224/05022 ,  H01L2224/05124 ,  H01L2224/05548 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/05664 ,  H01L2224/05666 ,  H01L2224/05671 ,  H01L2224/05684 ,  H01L2224/16 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/00014

摘要： A semiconductor device in the first embodiment includes: an electrode pad and a resin projection, formed on an active surface; a conductive film deposited from a surface of the electrode pad to a surface of the resin projection; a resin bump formed with the resin projection and with the conductive film. The semiconductor device is conductively connected to the opposing substrate through the resin bump electrode. The testing electrode is formed with the conductive film that is extended and applied to the opposite side of the electrode pad across the resin projection.

摘要翻译： 第一实施例中的半导体器件包括：形成在有源表面上的电极焊盘和树脂突起; 从所述电极焊盘的表面沉积到所述树脂突起的表面的导电膜; 树脂凸起与树脂突起形成并与导电膜形成。 半导体器件通过树脂凸块电极导电地连接到相对的基板。 测试电极由导电膜形成，该导电膜延伸并施加到穿过树脂突起的电极焊盘的相对侧。

公开(公告)号：US08183693B2

公开(公告)日：2012-05-22

申请号：US12897173

申请日：2010-10-04

申请人： Shuichi Tanaka ,  Haruki Ito

发明人： Shuichi Tanaka ,  Haruki Ito

IPC分类号： H01L23/52 ,  H01L23/48 ,  H01L29/40

CPC分类号： H01L24/10 ,  H01L24/13 ,  H01L24/29 ,  H01L24/83 ,  H01L24/90 ,  H01L2224/05001 ,  H01L2224/05022 ,  H01L2224/05548 ,  H01L2224/13 ,  H01L2224/13008 ,  H01L2224/13099 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29299 ,  H01L2224/838 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01051 ,  H01L2924/01074 ,  H01L2924/01082 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/14 ,  H01L2924/19043 ,  H01L2924/00 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/05599 ,  H01L2224/05099

摘要： A semiconductor device includes n1 first interconnects (n is an integer larger than one) respectively formed on first electrodes and extending over a first resin protrusion, and n2 second interconnects (n2

摘要翻译： 半导体器件包括分别形成在第一电极上并在第一树脂突起上延伸的n1个第一互连（n是大于一的整数），以及分别形成在第二电极上并在第二树脂突起上延伸的n2个第二互连（n2 < 。 第一和第二树脂突起由相同的材料形成，具有相同的宽度并且纵向延伸。 第一互连延伸以与第一树脂突起的纵向轴线相交，并且每个第一互连件在第一树脂突起上具有第一宽度W1。 第二互连延伸以与第二树脂突起的纵向轴线相交，并且每个第二互连件在第二树脂突起上具有第二宽度W2（W1

公开(公告)号：US20060288572A1

公开(公告)日：2006-12-28

申请号：US11446731

申请日：2006-06-05

申请人： Shuichi Tanaka ,  Haruki Ito

发明人： Shuichi Tanaka ,  Haruki Ito

IPC分类号： H05K3/10 ,  H01K3/22

CPC分类号： H01L24/13 ,  H01L24/11 ,  H01L2224/05001 ,  H01L2224/05022 ,  H01L2224/05124 ,  H01L2224/05548 ,  H01L2224/05624 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/05664 ,  H01L2224/05671 ,  H01L2224/114 ,  H01L2224/116 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2224/13624 ,  H01L2224/13644 ,  H01L2224/13647 ,  H01L2224/13655 ,  H01L2224/13664 ,  H01L2224/13666 ,  H01L2224/13671 ,  H01L2924/0001 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01018 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/07802 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/19043 ,  Y10T29/49155 ,  Y10T29/49158 ,  Y10T29/49204 ,  Y10T29/49224 ,  H01L2924/0665 ,  H01L2924/00014 ,  H01L2924/01074 ,  H01L2924/00

摘要： A method of manufacturing a semiconductor device includes (a) forming a first resin layer on a semiconductor substrate including an electrode pad and a passivation film, (b) curing the first resin layer, (c) forming a second resin layer which slopes more gently than the cured first resin layer on at least a lower portion of the first resin layer, (d) curing the second resin layer to form a resin protrusion including the first and second resin layers, and (e) forming a conductive layer which is electrically connected with the electrode pad and passes over the resin protrusion.

摘要翻译： 一种制造半导体器件的方法包括：（a）在包括电极焊盘和钝化膜的半导体衬底上形成第一树脂层，（b）固化第一树脂层，（c）形成更缓和地倾斜的第二树脂层 比第一树脂层的至少下部固化的第一树脂层，（d）固化第二树脂层以形成包括第一和第二树脂层的树脂突起，以及（e）形成导电层，其为电 与电极焊盘连接并且越过树脂突起。

公开(公告)号：US07246432B2

公开(公告)日：2007-07-24

申请号：US11446731

申请日：2006-06-05

申请人： Shuichi Tanaka ,  Haruki Ito

发明人： Shuichi Tanaka ,  Haruki Ito

IPC分类号： H01L21/60 ,  H01L23/48

CPC分类号： H01L24/13 ,  H01L24/11 ,  H01L2224/05001 ,  H01L2224/05022 ,  H01L2224/05124 ,  H01L2224/05548 ,  H01L2224/05624 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/05664 ,  H01L2224/05671 ,  H01L2224/114 ,  H01L2224/116 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2224/13624 ,  H01L2224/13644 ,  H01L2224/13647 ,  H01L2224/13655 ,  H01L2224/13664 ,  H01L2224/13666 ,  H01L2224/13671 ,  H01L2924/0001 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01018 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/07802 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/19043 ,  Y10T29/49155 ,  Y10T29/49158 ,  Y10T29/49204 ,  Y10T29/49224 ,  H01L2924/0665 ,  H01L2924/00014 ,  H01L2924/01074 ,  H01L2924/00

摘要： A method of manufacturing a semiconductor device includes (a) forming a first resin layer on a semiconductor substrate including an electrode pad and a passivation film, (b) curing the first resin layer, (c) forming a second resin layer which slopes more gently than the cured first resin layer on at least a lower portion of the first resin layer, (d) curing the second resin layer to form a resin protrusion including the first and second resin layers, and (e) forming a conductive layer which is electrically connected with the electrode pad and passes over the resin protrusion.

摘要翻译： 一种制造半导体器件的方法包括：（a）在包括电极焊盘和钝化膜的半导体衬底上形成第一树脂层，（b）固化第一树脂层，（c）形成更缓和地倾斜的第二树脂层 比第一树脂层的至少下部固化的第一树脂层，（d）固化第二树脂层以形成包括第一和第二树脂层的树脂突起，以及（e）形成导电层，其为电 与电极焊盘连接并且越过树脂突起。

公开(公告)号：US07830007B2

公开(公告)日：2010-11-09

申请号：US12181536

申请日：2008-07-29

申请人： Shuichi Tanaka ,  Haruki Ito

发明人： Shuichi Tanaka ,  Haruki Ito

IPC分类号： H01L23/52 ,  H01L23/48 ,  H01L29/40

CPC分类号： H01L24/10 ,  H01L24/13 ,  H01L24/29 ,  H01L24/83 ,  H01L24/90 ,  H01L2224/05001 ,  H01L2224/05022 ,  H01L2224/05548 ,  H01L2224/13 ,  H01L2224/13008 ,  H01L2224/13099 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29299 ,  H01L2224/838 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01051 ,  H01L2924/01074 ,  H01L2924/01082 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/14 ,  H01L2924/19043 ,  H01L2924/00 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/05599 ,  H01L2224/05099

摘要： A semiconductor device includes n1 first interconnects (n is an integer larger than one) respectively formed on first electrodes and extending over a first resin protrusion, and n2 second interconnects (n2

摘要翻译： 半导体器件包括分别形成在第一电极上并在第一树脂突起上延伸的n1个第一互连（n是大于一的整数），以及分别形成在第二电极上并在第二树脂突起上延伸的n2个第二互连（n2 < 。 第一和第二树脂突起由相同的材料形成，具有相同的宽度并且纵向延伸。 第一互连延伸以与第一树脂突起的纵向轴线相交，并且每个第一互连件在第一树脂突起上具有第一宽度W1。 第二互连延伸以与第二树脂突起的纵向轴线相交，并且每个第二互连件在第二树脂突起上具有第二宽度W2（W1

公开(公告)号：US08508042B2

公开(公告)日：2013-08-13

申请号：US13015011

申请日：2011-01-27

申请人： Shuichi Tanaka

发明人： Shuichi Tanaka

IPC分类号： H01L23/485

CPC分类号： H01L24/13 ,  G02F1/1345 ,  H01L24/11 ,  H01L24/14 ,  H01L24/29 ,  H01L24/32 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L2224/05001 ,  H01L2224/05024 ,  H01L2224/05026 ,  H01L2224/05124 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05548 ,  H01L2224/05624 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05655 ,  H01L2224/05664 ,  H01L2224/05671 ,  H01L2224/05684 ,  H01L2224/114 ,  H01L2224/116 ,  H01L2224/13008 ,  H01L2224/13099 ,  H01L2224/1319 ,  H01L2224/136 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/29 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/29298 ,  H01L2224/73204 ,  H01L2224/75252 ,  H01L2224/812 ,  H01L2224/81801 ,  H01L2224/83192 ,  H01L2224/838 ,  H01L2224/83851 ,  H01L2924/0001 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/15788 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/00 ,  H01L2924/01023 ,  H01L2924/01028 ,  H01L2924/00014 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299 ,  H01L2224/2929

摘要： An electronic device includes a semiconductor device and a wiring substrate having a wiring pattern. The semiconductor device includes: a semiconductor chip having an electrode; a convex-shaped resin protrusion provided on a surface of the semiconductor chip, the surface having the electrode; and wiring having a plurality of electrical coupling sections which are aligned on the resin protrusion and electrically coupled to the electrode. The semiconductor device is mounted to the wiring substrate so that the electrical coupling sections and the wiring pattern are brought into contact and electrically coupled with each other. The plurality of electrical coupling sections brought into contact with the wiring pattern include curved or bent shapes projecting in a longitudinal direction of the resin protrusion.

公开(公告)号：US07341335B2

公开(公告)日：2008-03-11

申请号：US11233117

申请日：2005-09-23

申请人： Fujio Akahane ,  Hisashi Miyazawa ,  Shuichi Tanaka

发明人： Fujio Akahane ,  Hisashi Miyazawa ,  Shuichi Tanaka

IPC分类号： B41J2/175

CPC分类号： B41J2/17509 ,  B41J2/17523 ,  B41J2/17596

摘要： A liquid ejection apparatus ejects liquid retained in a liquid container from a liquid ejection head. The apparatus includes a liquid supply needle having an outlet line that can be connected to the interior of the liquid container, a liquid supply line connecting the outlet line of the liquid supply needle to the recording head, and a control valve provided in the liquid supply line. The control valve closes the liquid supply line when negative pressure is applied to the liquid ejection head. A seal valve is arranged between the control valve and the liquid supply needle in the liquid supply line. The seal valve seals the liquid supply line using liquid pressure applied from the control valve to the outlet line. Accordingly, the liquid is prevented from leaking from the liquid supply needle when the liquid container is separated from the liquid supply needle.

摘要翻译： 液体喷射装置从液体喷射头喷射保留在液体容器中的液体。 该装置包括：液体供给针，具有能够连接到液体容器的内部的出口管，将液体供给针的出口管连接到记录头的液体供给管;以及设置在液体供给部中的控制阀 线。 当向液体喷射头施加负压时，控制阀关闭液体供应管线。 密封阀配置在液体供给管路中的控制阀与液体供给针之间。 密封阀使用从控制阀施加到出口管线的液体压力来密封液体供应管线。 因此，当液体容器与液体供给针分离时，防止液体从液体供给针泄漏。