发明申请
- 专利标题: Semiconductor package with heat sink
- 专利标题(中): 半导体封装带散热片
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申请号: US11212290申请日: 2005-08-26
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公开(公告)号: US20050280132A1公开(公告)日: 2005-12-22
- 发明人: Chang-Fu Lin , Han-Ping Pu , Cheng-Hsu Hsiao , Chien Huang
- 申请人: Chang-Fu Lin , Han-Ping Pu , Cheng-Hsu Hsiao , Chien Huang
- 优先权: TW92104505 20030304
- 主分类号: H01L23/367
- IPC分类号: H01L23/367 ; H01L23/06
摘要:
A semiconductor package with a heat sink is provided in which at least one chip is mounted on the substrate and covered by a heat sink. The heat sink is formed with a plurality of grooves or holes at positions in contact with the substrate, allowing an adhesive material to be applied between the heat sink and the substrate and filled into the grooves or holes for attaching the heat sink onto the substrate. The adhesive material filled into the grooves or holes provides an anchoring effect for firmly positioning the heat sink on the substrate. Therefore, it is not necessary to form predetermined holes on the substrate for being coupled to fixing members such as bolts, and incorporation of the heat sink would not affect trace routability and arrangement of input/output connections such as solder balls on the substrate and would not lead to cracks of the chip.
公开/授权文献
- US07177155B2 Semiconductor package with heat sink 公开/授权日:2007-02-13