Invention Application
- Patent Title: Ground plane for integrated circuit package
- Patent Title (中): 集成电路封装的接地层
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Application No.: US10873817Application Date: 2004-06-21
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Publication No.: US20050280138A1Publication Date: 2005-12-22
- Inventor: Udy Shrivastava , Kristopher Frutschy
- Applicant: Udy Shrivastava , Kristopher Frutschy
- Main IPC: H01L23/31
- IPC: H01L23/31 ; H01L23/498 ; H01L23/50 ; H01L23/52 ; H01L23/538 ; H01L25/10
Abstract:
An integrated circuit package includes a first chip and a folded flexible substrate. The flexible substrate has a first surface and an opposing second surface and is disposed to partially surround the first chip. A first routing layer is formed on the first surface of the flexible substrate and a second routing layer is formed on the second surface of the flexible substrate. A metal ground plane is formed on a selected one of the first and the second surfaces.
Public/Granted literature
- US07154175B2 Ground plane for integrated circuit package Public/Granted day:2006-12-26
Information query
IPC分类:
