Invention Application
- Patent Title: Heat treatment apparatus
- Patent Title (中): 热处理设备
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Application No.: US11058279Application Date: 2005-02-16
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Publication No.: US20050280681A1Publication Date: 2005-12-22
- Inventor: Tae-gyu Kim , Dong-woo Lee , Jin-sung Lee , Tae-sang Park , Bang-weon Lee
- Applicant: Tae-gyu Kim , Dong-woo Lee , Jin-sung Lee , Tae-sang Park , Bang-weon Lee
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Priority: KR2004-45856 20040619
- Main IPC: H01L21/324
- IPC: H01L21/324 ; B05B7/04 ; B41J2/04 ; H01L21/00 ; H01L21/02

Abstract:
Provided is a heat treatment apparatus. The heat treatment apparatus includes a heating plate including a heater; a chamber case including a cooling chamber, and coupled to a lower portion of the heating plate; and at least one atomizing unit installed on the chamber case to generate liquid droplet aerosol by mixing a cooling liquid and a gas, and at the same time, to inject the liquid droplet aerosol into the cooling chamber.
Public/Granted literature
- US07448604B2 Heat treatment apparatus Public/Granted day:2008-11-11
Information query
IPC分类: