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公开(公告)号：US07448604B2
公开(公告)日：2008-11-11
申请号：US11058279
申请日：2005-02-16
申请人： Tae-gyu Kim , Dong-woo Lee , Jin-sung Lee , Tae-sang Park , Bang-weon Lee
发明人： Tae-gyu Kim , Dong-woo Lee , Jin-sung Lee , Tae-sang Park , Bang-weon Lee
IPC分类号： B01F3/04
CPC分类号： H01L21/67109 , B05B7/0441
摘要： Provided is a heat treatment apparatus. The heat treatment apparatus includes a heating plate including a heater; a chamber case including a cooling chamber, and coupled to a lower portion of the heating plate; and at least one atomizing unit installed on the chamber case to generate liquid droplet aerosol by mixing a cooling liquid and a gas, and at the same time, to inject the liquid droplet aerosol into the cooling chamber.
摘要翻译： 提供一种热处理装置。 热处理装置包括：加热板，包括加热器; 包括冷却室的室壳体，并且联接到所述加热板的下部; 以及至少一个雾化单元，其安装在所述室壳体上以通过混合冷却液体和气体而产生液滴气溶胶，同时将所述液滴气溶胶喷射到所述冷却室中。
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公开(公告)号：US20060049168A1
公开(公告)日：2006-03-09
申请号：US11206842
申请日：2005-08-19
申请人： Dong-woo Lee , Jin-sung Lee , Jong-kill Lim , Bang-weon Lee , Tae-sang Park , Tae-gyu Kim
发明人： Dong-woo Lee , Jin-sung Lee , Jong-kill Lim , Bang-weon Lee , Tae-sang Park , Tae-gyu Kim
IPC分类号： H05B3/68
CPC分类号： H01L21/67109 , H01L21/67748 , H01L21/68 , H01L21/6838
摘要： A wafer bake apparatus includes an air flow control unit of pneumatic cylinder structure operating interlockingly with a wafer lift unit and induces the air flow between a wafer and a hot plate. Therefore, when a wafer is placed in a baking position the air between the wafer and the hot plate descends. As a result, the wafer is no longer under the influence of air resistance, and can be more accurately placed in the baking position. In addition, when the baked wafer is lifted to an unloading position, the air between the hot plate and the wafer ascends, which in turn supports the wafer and prevents the distortion of the wafer.
摘要翻译： 晶片烘烤装置包括与晶片提升单元联动操作的气缸结构的气流控制单元，并且在晶片和热板之间引起空气流动。 因此，当将晶片放置在烘烤位置时，晶片和热板之间的空气下降。 结果，晶片不再受到空气阻力的影响，并且可以更准确地放置在烘烤位置。 此外，当烘烤的晶片被提升到卸载位置时，加热板和晶片之间的空气上升，这又支持晶片并防止晶片的变形。
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公开(公告)号：US20060151462A1
公开(公告)日：2006-07-13
申请号：US11318539
申请日：2005-12-28
申请人： Jin-sung Lee , Dong-woo Lee , Tae-gyu Kim , Tae-sang Park , Bang-weon Lee , Jong-kill Lim , Chang-hoon Jung , Sang-Kwon Wee
发明人： Jin-sung Lee , Dong-woo Lee , Tae-gyu Kim , Tae-sang Park , Bang-weon Lee , Jong-kill Lim , Chang-hoon Jung , Sang-Kwon Wee
CPC分类号： H01L21/67109 , F27B5/04 , F27B5/14 , F27B17/0025
摘要： A semiconductor wafer baking apparatus includes a hot plate, a container of which an upper part is open, and a cover that covers the upper part of the container. The cover includes an upper plate, a lower plate and a side wall that form a gas circulating space therebetween. At least one gas inlet is formed in the side wall, a plurality of gas supply holes are formed in a central region of the lower plate, and a skirt on which is formed a gas exhaust unit is coupled to a lower edge of the cover.
摘要翻译： 半导体晶片烘烤装置包括热板，上部开口的容器和覆盖容器的上部的盖。 该盖包括在其间形成气体循环空间的上板，下板和侧壁。 在侧壁中形成至少一个气体入口，在下板的中心区域形成有多个气体供给孔，并且在其上形成有排气单元的裙部联接到盖的下边缘。
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公开(公告)号：US07115840B2
公开(公告)日：2006-10-03
申请号：US11206842
申请日：2005-08-19
申请人： Dong-woo Lee , Jin-sung Lee , Jong-kill Lim , Bang-weon Lee , Tae-sang Park , Tae-gyu Kim
发明人： Dong-woo Lee , Jin-sung Lee , Jong-kill Lim , Bang-weon Lee , Tae-sang Park , Tae-gyu Kim
CPC分类号： H01L21/67109 , H01L21/67748 , H01L21/68 , H01L21/6838
摘要： A wafer bake apparatus includes an air flow control unit of pneumatic cylinder structure operating interlockingly with a wafer lift unit and induces the air flow between a wafer and a hot plate. Therefore, when a wafer is placed in a baking position the air between the wafer and the hot plate descends. As a result, the wafer is no longer under the influence of air resistance, and can be more accurately placed in the baking position. In addition, when the baked wafer is lifted to an unloading position, the air between the hot plate and the wafer ascends, which in turn supports the wafer and prevents the distortion of the wafer.
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公开(公告)号：US07377776B2
公开(公告)日：2008-05-27
申请号：US11318539
申请日：2005-12-28
申请人： Jin-sung Lee , Dong-woo Lee , Tae-gyu Kim , Tae-sang Park , Bang-weon Lee , Jong-kill Lim , Chang-hoon Jung , Sang-kwon Wee
发明人： Jin-sung Lee , Dong-woo Lee , Tae-gyu Kim , Tae-sang Park , Bang-weon Lee , Jong-kill Lim , Chang-hoon Jung , Sang-kwon Wee
IPC分类号： H05B3/68
CPC分类号： H01L21/67109 , F27B5/04 , F27B5/14 , F27B17/0025
摘要： A semiconductor wafer baking apparatus includes a hot plate, a container of which an upper part is open, and a cover that covers the upper part of the container. The cover includes an upper plate, a lower plate and a side wall that form a gas circulating space therebetween. At least one gas inlet is formed in the side wall, a plurality of gas supply holes are formed in a central region of the lower plate, and a skirt on which is formed a gas exhaust unit is coupled to a lower edge of the cover.
摘要翻译： 半导体晶片烘烤装置包括热板，上部开口的容器和覆盖容器的上部的盖。 该盖包括在其间形成气体循环空间的上板，下板和侧壁。 在侧壁中形成至少一个气体入口，在下板的中心区域形成有多个气体供给孔，并且在其上形成有排气单元的裙部联接到盖的下边缘。
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公开(公告)号：US20060174836A1
公开(公告)日：2006-08-10
申请号：US11267406
申请日：2005-11-07
申请人： Bang-weon Lee , Tae-gyu Kim , Jin-sung Lee , Dong-woo Lee , Tae-sang Park , Chang-hoon Jung , Sang-kwon Wee
发明人： Bang-weon Lee , Tae-gyu Kim , Jin-sung Lee , Dong-woo Lee , Tae-sang Park , Chang-hoon Jung , Sang-kwon Wee
CPC分类号： H01L21/67103 , H05B3/143
摘要： An apparatus for heating a wafer includes a hot plate, formed of, for example, ceramic, which heats the wafer mounted thereon, a case supporting the hot plate, and a fixing unit fixing the hot plate to the case that is located under the hot plate. The fixing unit may include a ball for contacting and pressing the hot plate, and an elastic spring which presses the ball and which compresses when the hot plate expands thermally.
摘要翻译： 用于加热晶片的装置包括由例如陶瓷形成的加热板，其加热安装在其上的晶片，支撑热板的壳体和将热板固定到位于热的下方的壳体的固定单元 盘子。 固定单元可以包括用于接触和按压加热板的球，以及当热板热膨胀时挤压球并且压缩的弹性弹簧。
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公开(公告)号：US20050280681A1
公开(公告)日：2005-12-22
申请号：US11058279
申请日：2005-02-16
申请人： Tae-gyu Kim , Dong-woo Lee , Jin-sung Lee , Tae-sang Park , Bang-weon Lee
发明人： Tae-gyu Kim , Dong-woo Lee , Jin-sung Lee , Tae-sang Park , Bang-weon Lee
IPC分类号： H01L21/324 , B05B7/04 , B41J2/04 , H01L21/00 , H01L21/02
CPC分类号： H01L21/67109 , B05B7/0441
摘要： Provided is a heat treatment apparatus. The heat treatment apparatus includes a heating plate including a heater; a chamber case including a cooling chamber, and coupled to a lower portion of the heating plate; and at least one atomizing unit installed on the chamber case to generate liquid droplet aerosol by mixing a cooling liquid and a gas, and at the same time, to inject the liquid droplet aerosol into the cooling chamber.
摘要翻译： 提供一种热处理装置。 热处理装置包括：加热板，包括加热器; 包括冷却室的室壳体，并且联接到所述加热板的下部; 以及至少一个雾化单元，其安装在所述室壳体上以通过混合冷却液体和气体而产生液滴气溶胶，同时将所述液滴气溶胶喷射到所述冷却室中。
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公开(公告)号：US20060237421A1
公开(公告)日：2006-10-26
申请号：US11397604
申请日：2006-04-05
申请人： Dong-woo Lee , Tae-gyu Kim , Jin-sung Lee , Bang-weon Lee
发明人： Dong-woo Lee , Tae-gyu Kim , Jin-sung Lee , Bang-weon Lee
CPC分类号： F27B17/0025 , F27B5/04 , H01L21/67103
摘要： A heating apparatus and a method of driving the same. The heating apparatus includes: a heating plate on which an object to be heated is loaded and which is partitioned into a plurality of heating zones; a main heating apparatus that is placed on a lower portion of the heating plate and uniformly heats the entire heating plate; and a plurality of subheaters located below the heating plate and disposed to respectively correspond to the heating zones, such that each of the subheaters heats a corresponding one of the heating zones.
摘要翻译： 一种加热装置及其驱动方法。 加热装置包括：加热板，加热对象物被加载在该加热板上，并被分隔成多个加热区域; 主加热装置，放置在加热板的下部并均匀地加热整个加热板; 以及位于所述加热板下方并分别对应于所述加热区域的多个次要热源，使得每个所述辅助热器加热相应的所述加热区域。
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公开(公告)号：US20120181559A1
公开(公告)日：2012-07-19
申请号：US13347163
申请日：2012-01-10
申请人： Jong-kil Park , Jae-sung You , Sung-uk Zhang , Tae-gyu Kim , Bang-weon Lee
发明人： Jong-kil Park , Jae-sung You , Sung-uk Zhang , Tae-gyu Kim , Bang-weon Lee
CPC分类号： H01L33/58 , H01L33/507 , H01L33/54 , H01L33/62 , H01L2224/48091 , H01L2224/48247 , H01L2224/8592 , H01L2924/12044 , H01L2924/181 , H01L2933/0091 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： A light-emitting device package including: a package main body including a cavity and a lead frame including a mounting portion disposed in the cavity and a plurality of terminal portions; a light-emitting device chip mounted on the mounting portion; a plurality of bonding wires for electrically connecting the plurality of terminal portions and the light-emitting device chip; a light-transmitting encapsulation layer filled in the cavity; and a light-transmitting cap member disposed in the cavity and blocking the encapsulation layer to contact the plurality of bonding wires.
摘要翻译： 一种发光器件封装，包括：包括空腔的封装主体和包括设置在所述空腔中的安装部分和多个端子部分的引线框架; 安装在所述安装部上的发光装置芯片; 多个用于电连接所述多个端子部分和所述发光器件芯片的接合线; 填充在空腔中的透光封装层; 以及设置在所述空腔中并阻挡所述封装层以接触所述多个接合线的透光盖构件。
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公开(公告)号：US08564005B2
公开(公告)日：2013-10-22
申请号：US13347163
申请日：2012-01-10
申请人： Jong-kil Park , Jae-sung You , Sung-uk Zhang , Tae-gyu Kim , Bang-weon Lee
发明人： Jong-kil Park , Jae-sung You , Sung-uk Zhang , Tae-gyu Kim , Bang-weon Lee
IPC分类号： H01L33/50
CPC分类号： H01L33/58 , H01L33/507 , H01L33/54 , H01L33/62 , H01L2224/48091 , H01L2224/48247 , H01L2224/8592 , H01L2924/12044 , H01L2924/181 , H01L2933/0091 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： A light-emitting device package including: a package main body including a cavity and a lead frame including a mounting portion disposed in the cavity and a plurality of terminal portions; a light-emitting device chip mounted on the mounting portion; a plurality of bonding wires for electrically connecting the plurality of terminal portions and the light-emitting device chip; a light-transmitting encapsulation layer filled in the cavity; and a light-transmitting cap member disposed in the cavity and blocking the encapsulation layer to contact the plurality of bonding wires.
摘要翻译： 一种发光器件封装，包括：包括空腔的封装主体和包括设置在所述空腔中的安装部分和多个端子部分的引线框架; 安装在所述安装部上的发光装置芯片; 多个用于电连接所述多个端子部分和所述发光器件芯片的接合线; 填充在空腔中的透光封装层; 以及设置在所述空腔中并阻挡所述封装层以接触所述多个接合线的透光盖构件。
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