Invention Application
- Patent Title: Phase change materials as a heat sink for computers
- Patent Title (中): 相变材料作为电脑散热片
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Application No.: US11146287Application Date: 2005-06-07
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Publication No.: US20050280987A1Publication Date: 2005-12-22
- Inventor: Benjamin Kwitek , Tsuyoshi Taira , Monte Magill
- Applicant: Benjamin Kwitek , Tsuyoshi Taira , Monte Magill
- Main IPC: G06F1/20
- IPC: G06F1/20 ; H05K7/20
Abstract:
An electronic device includes a housing in which electronic components are stored. A heat sink is positioned adjacent the housing, wherein the heat sink is composed of a phase change material.
Information query
