发明申请
- 专利标题: Sheet material and wiring board
- 专利标题(中): 板材和接线板
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申请号: US11167623申请日: 2005-06-27
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公开(公告)号: US20050281995A1公开(公告)日: 2005-12-22
- 发明人: Hideya Murai , Tadanori Shimoto , Kazuhiro Baba , Katsumi Kikuchi
- 申请人: Hideya Murai , Tadanori Shimoto , Kazuhiro Baba , Katsumi Kikuchi
- 优先权: JP2002-380631 20021227
- 主分类号: B32B7/12
- IPC分类号: B32B7/12 ; H05K3/46 ; B32B3/00 ; B32B15/00
摘要:
In a sheet material (1), a bonding layer (2) is provided, and then a high-strength layer (3) is laminated on the bonding layer (2). The bonding layer (2) is made of an epoxy resin being a thermosetting material. The high-strength layer (3) is made of polyimide, which is not softened at a thermosetting temperature of the epoxy resin and has a tensile rupture strength higher than that of the cured thermosetting material. Moreover, the polyimide has a tensile rupture strength of 100 MPa or higher at 23° C. and a tensile rupture elongation of 10% or higher at 23° C. Assuming that a tensile rupture strength at −65° C. is a and a tensile rupture strength at 150° C. is b, a ratio (a/b) is 2.5 or less.
公开/授权文献
- US07294393B2 Sheet material and wiring board 公开/授权日:2007-11-13
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