发明申请
US20050282352A1 Method of forming dual gate dielectric layer 有权
形成双栅介电层的方法

Method of forming dual gate dielectric layer
摘要:
A method of forming a dual gate dielectric layer increases a performance of a semiconductor device by using a dielectric layer having a high dielectric constant, including forming a first dielectric layer having a predetermined thickness on a semiconductor substrate; removing the first dielectric layer formed on a second region, but leaving this layer on a first region; and forming a second dielectric layer having a dielectric constant higher than that of the first dielectric layer, on the first and second regions.
公开/授权文献
信息查询
0/0